ADP2119-EVALZ Analog Devices Inc, ADP2119-EVALZ Datasheet - Page 5

• Manufacturer Part Number: ADP2119-EVALZ
• Description: Step-Down Regulator Eval. Board
• Manufacturer: Analog Devices Inc

Specifications of ADP2119-EVALZ

• Silicon Manufacturer: Analog Devices
• Application Sub Type: Step Down DC/DC Converter
• Kit Application Type: Power Management - Voltage Regulator
• Silicon Core Number: ADP2119
• Main Purpose: DC/DC, Step Down
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 0.6V ~ Vin
• Current - Output: 2A
• Voltage - Input: 2.3 ~ 5.5 V
• Regulator Topology: Buck
• Frequency - Switching: 1.2MHz
• Board Type: Fully Populated
• Utilized Ic / Part: ADP2119
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, PVIN
SW
FB, SYNC/MODE, EN, TRK, PGOOD
PGND to GND
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +0.3 V
−40°C to +125°C
−65°C to +150°C
JEDEC J-STD-020
Rev. 0 | Page 5 of 24
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
10-Lead LFCSP_WD
BOUNDARY CONDITION
θ
board, and the exposed pad is soldered to the printed circuit
board (PCB) with thermal vias.
ESD CAUTION
JA
JA
is specified for the worst-case conditions, that is, a device
is measured using natural convection on a JEDEC 4-layer
ADP2119/ADP2120
θ
40
JA
Unit
°C/W