WX-3009-0227-6 3M, WX-3009-0227-6 Datasheet - Page 2

• Manufacturer Part Number: WX-3009-0227-6
• Description: 5595 THERMAL PAD 210MM X 300MM 2MM SHEET
• Manufacturer: 3M

Specifications of WX-3009-0227-6

• Colour: Grey
• Svhc: No SVHC (15-Dec-2010)
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3M
Typical Physical Properties and Performance Characteristics
Note: The following technical information and data should be considered representative or typical only and should not be
Application Guidelines
Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance.
A clean surface can improve the thermal performance of an application.
1.) Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface
2.) Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to
3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with
Note: *Interface Pad 5595S has a 9 micrometer PEN Film added to provide for a non-tacky surface, increased puncture resistance, ease of handling and
contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often contain oily
components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents
(such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease,
machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using solvents.
help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner
before application.
the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat.
Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because
one of the flexible substrate can conform to the other substrates during application.
™
rework. **Interface Pad 5595 tested with-out PET film on product. ***9 µm PEN film is a non-FR version. ****Potential Operating Temperature
Range (°C). End use application testing will determine final temperature range based on final design and other environmental conditions. Suggested
Temperature range is based on a 3M Test Method.
Property
Product Number*
Thermal Conductivity (W/m-K)
Operating Temperature Range****
Shelf Life
Hardness Shore 00**
Dielectric Breakdown
Volume Resistivity
Flammability Rating***
used for specification purposes.
Thermally Conductive Interface Pads 5595/5595S
Shore 00 results depend on test method and thickness of the
24 months from date of manufacturing when stored at 25°C
and 50% relative humidity in the pads original packaging.
3M™ Thermally Conductive Interface Pads 5595 / 5595S
sample tested. Typical results are in the 50-60 Shore 00
range @ 6 mm test thickness without the PEN film.
Shelf life relates to liner release characteristics.
5 x 10
400 V/mil AC (Interface Pad 5595S tested)
Ask 3M for more details on pad softness.
12
Ohms (Interface Pad 5595S tested)
UL-94-V0 (3M tested.)
(2)
-60° to 125°C
1.6 W/m-K
Method
with low pressure
3M Test Method
3M Test Method
3M Test Method
UL-94-V0 TM
ASTM D2240
(ASTM D149)
ASTM D257
(<10 psi)
Modified
3M TM
Value