MC33272 MULTICOMP, MC33272 Datasheet
MC33272
Manufacturer Part Number
MC33272
Description
Heat Sink
Manufacturer
MULTICOMP
Datasheet
1.MC33294.pdf
(1 pages)
Specifications of MC33272
Packages Cooled
TO-218 / TO-220 / TO-247
Thermal Resistance
7.2°C/W
Width
35mm
Height
38mm
Length
25.4mm
Mounting Type
PC Board Thru Hole
Package / Case
TO-218, TO-220, TO-247
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC33272
Manufacturer:
MOTOROLA/摩托罗拉
Quantity:
20 000
Part Number:
MC33272AD
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC33272ADG
Manufacturer:
ON Semiconductor
Quantity:
4
Company:
Part Number:
MC33272ADR
Manufacturer:
AVX
Quantity:
5 510
Company:
Part Number:
MC33272ADR2
Manufacturer:
ONSE
Quantity:
3 199
Part Number:
MC33272ADR2
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MC33272ADR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Heatsink Extruded
Clip 2
Mfg Part No:
MC33272
MC33273
MC33274
MC33275
Mfg Part No:
MC33294
Compact, high power dissipation, vertical
mounting extruded heatsinks with solder-
able fixing pins. Designed to accomodate
a single TO218/TO220/TO247 package via
clip, available separately, or with mounting
hole. Choice of thermal resistance.
Product Features:
•
•
•
http://www.farnell.com
http://www.newark.com
http://www.cpc.co.uk
High power extruded design
PCB mounting pins
Screw or clip fitting
Thermal Resistance:
7.2
7.2
5.9
5.9
Description:
Clip 2
o
o
o
o
C/W
C/W
C/W
C/W
Height
P
a
Height
38mm
38mm
50mm
50mm
g
e
<
1
>
Device Mtg:
Clip 2
Hole
Clip 2
Hole
2
2
1 /
0
0 /
8
V
1
1 .
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