ICK BGA 27X27 FISCHER ELEKTRONIK, ICK BGA 27X27 Datasheet

ICK BGA 27X27

Manufacturer Part Number

ICK BGA 27X27

Description

HEAT SINK, BALL GRID

Manufacturer

FISCHER ELEKTRONIK

Datasheet

1.ICK_BGA_23X23.pdf (1 pages)

Specifications of ICK BGA 27X27

Packages Cooled

BGA

Thermal Resistance

20Â°C/W

External Width

27mm

Height

6mm

Heat Sink Material

Aluminium

External Depth

27mm

External Length / Height

6mm

Surface Finish

Plain

External Height

6mm

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

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Heatsinks for PGAs and BGAs

Thermal conduct. foil WLFT 404/405

Thermal conductive glue

Thermal conductive paste

Processor overview

ICK BGA 23 x 23

WLF ... 23 x 23

ICK BGA 23 x 23 x 10

WLF ... 23 x 23

ICK BGA 27 x 27

WLF ... 27 x 27

ICK BGA 27 x 27 x 10

WLF ... 27 x 27

ICK BGA 31 x 31

WLF ... 31 x 31

ICK BGA 31 x 31 x 10

WLF ... 31 x 31

art. no.

E 5

E 14

E 12

B 2 - 7

SMD-heatsinks

Mounting material for semiconduct.

Hole pattern

Technical introduction

Hola1

B 25 – 27

E 34 – 38

A 21

A 2 - 7

B 14

Related parts for ICK BGA 27X27

Related keywords

ICK BGA 27X27 datasheet
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ICK BGA 27X27 pdf datasheet
ICK BGA 27X27 component
ICK BGA 27X27 part
ICK BGA 27X27 distributor
ICK BGA 27X27 RoHS
ICK BGA 27X27 datasheet download