ICK BGA 23X23 FISCHER ELEKTRONIK, ICK BGA 23X23 Datasheet
![HEAT SINK, BALL GRID](/photos/23/72/237244/121170206-40_sml.jpg)
ICK BGA 23X23
Manufacturer Part Number
ICK BGA 23X23
Description
HEAT SINK, BALL GRID
Manufacturer
FISCHER ELEKTRONIK
Datasheet
1.ICK_BGA_23X23.pdf
(1 pages)
Specifications of ICK BGA 23X23
Packages Cooled
BGA / PLCC-68
Thermal Resistance
23°C/W
External Width
23mm
Height
6mm
External Depth
23mm
External Length / Height
6mm
Surface Finish
Plain
External Height
6mm
Fixing
RoHS Compliant
H
H
H
H
Heatsinks for PGAs and BGAs
Thermal conduct. foil WLFT 404/405
Thermal conductive glue
Thermal conductive paste
Processor overview
ICK BGA 23 x 23
WLF ... 23 x 23
ICK BGA 23 x 23 x 10
WLF ... 23 x 23
ICK BGA 27 x 27
WLF ... 27 x 27
ICK BGA 27 x 27 x 10
WLF ... 27 x 27
ICK BGA 31 x 31
WLF ... 31 x 31
ICK BGA 31 x 31 x 10
WLF ... 31 x 31
art. no.
art. no.
art. no.
art. no.
art. no.
art. no.
E 5
E 14
E 12
B 2 - 7
SMD-heatsinks
Mounting material for semiconduct.
Hole pattern
Technical introduction
Hola1
B 25 – 27
E 34 – 38
A 21
A 2 - 7
B 14
H
H
M
G
N
D
H
A
B
K
C
E
F
L
I