CCI02 CCI, CCI02 Datasheet

HEAT SINK, 45X45X10MM

CCI02

Manufacturer Part Number
CCI02
Description
HEAT SINK, 45X45X10MM
Manufacturer
CCI
Datasheet

Specifications of CCI02

Packages Cooled
BGA
Thermal Resistance
7.93°C/W
External Width
45mm
Height
10mm
Heat Sink Material
Aluminium
External Depth
10mm
External Length / Height
45mm
Surface Finish
Anodised
External Height
10mm
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CCI0201A33NR-1J
Manufacturer:
LAIRD/莱尔
Quantity:
20 000
Part Number:
CCI0201A3N0R-1B
Manufacturer:
LAIRD/莱尔
Quantity:
20 000
Part Number:
CCI0201A4N3R-1S
Manufacturer:
LAIRD/莱尔
Quantity:
20 000
Part Number:
CCI0201A6N8R-1J
Manufacturer:
LAIRD/莱尔
Quantity:
20 000
Part Number:
CCI0201A7N5R-1J
Manufacturer:
LAIRD/莱尔
Quantity:
20 000
CCIC BGA heat sinks
Technical specifications:
-
-
-
00C845401A
Part Number
Aluminium BGA and compact crosscut heat sinking for a variety of
applications requiring simple extension of surface area for cooling.
Typically used with DSP, FPGAs, and other electronics packages.
Double sided adhesive provides simple and effective attachment
CCI02
CCI08
CCI09
CCI10
CCI11
Length
Width
45
28
30
38
25
40
&
Height
10
10
9
9
6
5
ambient) K
resistance
/ W at 0.3
Thermal
(sink to
7.93
9.51
9.96
9.12
9.38
m/s
9.6
resistance
ambient)
Thermal
K / W at
(sink to
1.0 m/s
3.57
5.29
5.87
4.65
5.14
5.3

Related parts for CCI02

CCI02 Summary of contents

Page 1

... Aluminium BGA and compact crosscut heat sinking for a variety of applications requiring simple extension of surface area for cooling. - Typically used with DSP, FPGAs, and other electronics packages. - Double sided adhesive provides simple and effective attachment Technical specifications: Width & Length Part Number 45 CCI02 28 CCI08 30 CCI09 38 CCI10 25 00C845401A 40 CCI11 Height ...

Page 2

... CCI Heat Pipes - Copper heat pipes, pure water filled for operation between +5 degC and 110 degC. - Various wick structures offered, Screen mesh, Grooved, Sintered and composite (G+S) - Low thermal resistance for transportation of heat from hot source to exchanger. Heat pipe can be incorporate into a block and fix a finned structure (or heat sink) to allow effective heat removal ...

Page 3

Design Guidelines (1) Groove heatpipe condenser evaporator • The heatpipe performance is without change from -90 deg to 0 deg. Larger than 0 deg (i.e. evaporator is higher than condenser), the performance of grooved pipe will degrade 50%. (2) Mesh ...

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