262-75AB01 Wakefield Thermal Solutions, 262-75AB01 Datasheet - Page 4

• Manufacturer Part Number: 262-75AB01
• Description: Heat Sink
• Manufacturer: Wakefield Thermal Solutions

Specifications of 262-75AB01

• Packages Cooled: TO-220
• Thermal Resistance: 40°C/W
• Width: 14.5mm
• Height: 19.1mm
• Heat Sink Material: Aluminum
• Length: 12.7mm
• Package / Case: TO-220
• Color: Black

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
100
100
100
80
60
40
80
60
40
20
80
60
40
20
0
0
0
0
0
0
0
200
200
200
200
200
0.5
1
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
1.0
2
600
600
1.5
600
600
600
3
800
800
2.0
800
800
4
800
1000
1000
1000
1000
2.5
5
1000
25
20
15
10
5
0
20
18
16
14
12
10
8
6
4
2
0
10
8
6
4
100
100
100
80
60
40
20
80
60
40
20
80
60
40
20
100
100
0
0
0
80
60
40
20
80
60
40
20
100
80
60
40
0
0
0
0
0
0
0
0
0
0
0
0
0
200
200
200
200
200
200
0.5
200
200
200
200
2
0.5
1
200
1
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
AIR VELOCITY (LFM)
400
400
400
400
1.0
400
400
400
400
2
4
1.0
400
2
600
600
1.5
600
600
600
600
600
600
600
600
3
1.5
6
600
3
800
800
2.0
800
800
4
800
800
800
800
800
800
2.0
4
8
800
1000
1000
1000
1000
2.5
5
1000
1000
1000
1000
1000
1000
10
5
1000
2.5
25
20
15
10
5
0
20
18
16
14
12
10
8
6
4
2
0
10
8
6
4
2
0
10
8
6
4
2
0
25
20
15
10
5
0
10
8
6
4
100
100
80
60
40
20
100
80
60
40
20
0
0
80
60
40
20
0
0
0
0
0
0
0