MC33276 MULTICOMP, MC33276 Datasheet

Heat Sink

MC33276

Manufacturer Part Number
MC33276
Description
Heat Sink
Manufacturer
MULTICOMP
Datasheet

Specifications of MC33276

Packages Cooled
TO-218 / TO-220 / TO-247
Thermal Resistance
7°C/W
Width
51mm
Height
35mm
Length
29.44mm
Mounting Type
PC Board Thru Hole
Package / Case
TO-218, TO-220, TO-247
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Heatsink Extruded
Mfg Part No:
MC33276
High power dissipation heatsink, with
solderable tags. Predrilled for a single
TO218/220 and TO247 package.
Product Features:
http://www.farnell.com
http://www.newark.com
http://www.cpc.co.uk
Low thermal resistance
Black anodise finish
Thermal Resistance:
7.0
o
C/W
P
a
Height (mm):
42
g
e
<
1
>
24
Device Mtg:
Mounting Hole
2
2
1 /
0
0 /
8
V
1
1 .

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