MC33267 MULTICOMP, MC33267 Datasheet

Heat Sink

MC33267

Manufacturer Part Number

MC33267

Description

Heat Sink

Manufacturer

MULTICOMP

Datasheet

1.MC33297.pdf (1 pages)

Specifications of MC33267

Packages Cooled

TO-218 / TO-220

Thermal Resistance

3.1Â°C/W

Width

41.6mm

Height

63.5mm

Length

25mm

Mounting Type

PC Board Thru Hole

Package / Case

TO-218, TO-220

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Bonase Electronics (HK) Co., Limited

Part Number:

MC33267T

Manufacturer:

MOSFEC

Quantity:

1 357

Company:

Meier Automation Equipment Co., Limited

Meier Automation Equipment Co., Limited

Part Number:

MC33267T

Manufacturer:

MOT/ON

Quantity:

20 000

Company:

H&T Electronics

H&T Electronics

Part Number:

MC33267T

Quantity:

10 000

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Clip 5

Heatsink Extruded

Mfg Part No:

MC33297

Mfg Part No:

MC33265

MC33266

MC33267

A high power dissipation, vertical mount-

ing extruded heatsink with solderable

fixing pins and notched base. Pre-drilled

for a single TO218/220 package or via clip

available separately.

Product Features:

•

•

•

•

•

Choice of thermal resistance

Notched base

Solderable mounting pins

Pre-drilled mounting holes

Black anodize finish

http://www.farnell.com

http://www.newark.com

http://www.cpc.co.uk

Description:

Clip 5

Thermal Resistance:

3.9

3.6

3.1

o

o

o

C/W

C/W

C/W

P

Height (mm):

38.1

50.8

63.5

a

g

e

<

1

>

Device Mtg:

Clip 5

Clip 5

Clip 5

2

2

1 /

0

0 /

8

V

1

1 .

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