MC33260 MULTICOMP, MC33260 Datasheet

Heat Sink

MC33260

Manufacturer Part Number
MC33260
Description
Heat Sink
Manufacturer
MULTICOMP
Datasheet

Specifications of MC33260

Packages Cooled
SOT-23 / TO-126 / TO-220
Thermal Resistance
13.6°C/W
Width
25.4mm
Height
29.97mm
Length
12.7mm
Mounting Type
PC Board Thru Hole
Package / Case
SOT-23, TO-126, TO-220
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC33260D
Manufacturer:
ON Semiconductor
Quantity:
83
Part Number:
MC33260DG
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MC33260DR2G
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MC33260P
Manufacturer:
MOT
Quantity:
5 510
Part Number:
MC33260P
Manufacturer:
ON
Quantity:
642
Part Number:
MC33260P
Manufacturer:
ON/安森美
Quantity:
20 000
Part Number:
MC33260PCKTV
Manufacturer:
MOT
Quantity:
5 510
Part Number:
MC33260PCKTV
Manufacturer:
INTEL
Quantity:
5 510
Part Number:
MC33260PG
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC33260PG
Quantity:
950
Heatsink
Mfg Part No:
MC33260
Heatsink with a slotted hole for a single
SOT23,TO126 and TO220 package with
integral fixing tags.
Product Features:
Low cost stamped heatsink
Black anodize finish
http://www.farnell.com
http://www.newark.com
http://www.cpc.co.uk
Thermal Resistance:
13.6
o
C/W
P
Height (mm):
30
a
g
e
<
1
>
Device Mtg:
Slotted Mounting Hole
2
2
1 /
0
0 /
8
V
1
1 .

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