262-75ABE-05 Wakefield Thermal Solutions, 262-75ABE-05 Datasheet - Page 3

• Manufacturer Part Number: 262-75ABE-05
• Description: Board Level Heat Sinks For TO-220 & TO-218 & Multiwatt Components
• Manufacturer: Wakefield Thermal Solutions
• Series: 262r

Specifications of 262-75ABE-05

• Package Cooled: TO-220
• Attachment Method: Press Fit and PC Pin
• Outline: 14.48mm x 12.70mm
• Height: 0.750" (19.05mm)
• Power Dissipation @ Temperature Rise: 3W @ 80°C
• Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM
• Thermal Resistance @ Natural: 26.7°C/W
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Aluminum
• Dimensions: 12.7 mm L x 14.5 mm W x 19.1 mm H
• Designed For: TO-220
• Color: Black
• Thermal Resistance: 10°C/W
• Width: 14.5mm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 262-75AB-05; 26275AB05; 345-1085

BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
100
100
40
20
80
60
40
20
80
60
40
20
0
0
0
0
0
0
0
0
200
200
200
200
200
0.5
2
1
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
400
400
400
400
400
1.0
2
4
600
1.5
600
600
600
600
3
6
800
2.0
800
800
4
800
800
8
1000
1000
1000
2.5
5
1000
1000
10
10
5
0
20
18
16
14
12
10
8
6
4
2
0
10
8
6
4
2
0
100
80
60
40
20
100
40
20
0
0
80
60
40
20
0
0
0
0
0
0
200
200
200
0.5
200
200
1
2
HEA
HEA
HEA
A