VMMK-2303-TR1G Avago Technologies US Inc., VMMK-2303-TR1G Datasheet - Page 9

• Manufacturer Part Number: VMMK-2303-TR1G
• Description: GaAsCap Amplifier
• Manufacturer: Avago Technologies US Inc.

Specifications of VMMK-2303-TR1G

• Current - Supply: 21mA
• Frequency: 500MHz ~ 6GHz
• Gain: 14dB
• Noise Figure: 2dB
• P1db: 9dBm
• Package / Case: 0402 (1005 Metric) - 1.00mm L x 0.50mm W x 0.25mm H
• Rf Type: Cellular, W-CDMA, PCS
• Test Frequency: 3GHz
• Voltage - Supply: 1.8V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Outline Drawing
Top and Side View
Bottom View
Notes:
1. x indicates pin 1
2. Dimensions are in millimeters
3. Pad Material is minimum 5.0 um thick Au
Suggested PCB Material and Land Pattern
Notes:
1. 0.010” Rogers RO4350
9
0.5 mm
.022 [0.559]
0.2mm
0.3mm
.014 [0.356]
0.7mm
0.8mm
EY
1.05mm
.008 [0.203]
.010 [0.254]
.014 [0.356]
.005 [0.127]
.020 [0.508]
Recommended SMT Attachment
The VMMK Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Manual Assembly for Prototypes
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers or
3. Recommended attachment is solder paste. Please
4. Apply solder paste using either a stencil printer or
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak
7. Clean off flux per vendor’s recommendations.
8. Clean the module with Acetone. Rinse with alcohol.
to be worn at all times when handling these devices.
For more detail, refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control
ESD Machine Model (Class A)
ESD Human Body Model (Class A)
from topside if using a vacuum collet.
see recommended solder reflow profile. Conductive
epoxy is not recommended. Hand soldering is not
recommended.
dot placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance. Excessive solder will degrade RF
performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tempe-
rature to the pre-heat temp to avoid damage due to
thermal shock.
temperature of 280qC for 15 sec. Verify that the profile
will not expose device beyond these limits.
Allow the module to dry before testing.
Note: These devices are ESD
sensitive. The following precau-
tions are strongly recommend-
ed. Ensure that an ESD approved
carrier is used when die are trans-
ported from one destination to
another. Personal grounding is