VMMK-2103-BLKG Avago Technologies US Inc., VMMK-2103-BLKG Datasheet - Page 10

• Manufacturer Part Number: VMMK-2103-BLKG
• Description: GaAsCap Amplifier
• Manufacturer: Avago Technologies US Inc.

Specifications of VMMK-2103-BLKG

• Current - Supply: 24mA
• Frequency: 500MHz ~ 6GHz
• Gain: 14dB
• Noise Figure: 2.1dB
• P1db: 0dBm
• Package / Case: 0402 (1005 Metric) - 1.00mm L x 0.50mm W x 0.25mm H
• Rf Type: Cellular, PCS
• Test Frequency: 3GHz
• Voltage - Supply: 5V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 516-2216; VMMK-2103-BLKG

Outline Drawing
Top and Side View
Bottom View
Notes:
1. x indicates pin 1
2. Dimensions are in millimeters
3. Pad Material is minimum 5.0 um thick Au
Suggested PCB Material and Land Pattern
Notes:
1. 0.010” Rogers RO4350
10
0.5 mm
Part of
0.500 (0.020)
Circuit
Input
see discussion
0.100 (0.004)
0.2mm
(0.003) 2pl -
0.076 max
0.3mm
0.381 (0.015) 2pl
0.7mm
0.8mm
CY
1.00mm
(0.008)
1.2 (0.048)
0.200
(0.008)
0.200
0.254 dia PTH
(0.010) 4pl
0.400 (0.016)
(0.016) 4pl
0.400 dia
0.100 (0.004)
0.500 (0.020)
Solder Mask
Output
Part of
Circuit
0.7 (0.028)
Recommended SMT Attachment
The VMMK Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
Manual Assembly for Prototypes
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers or
3. Recommended attachment is solder paste. Please
4. Apply solder paste using either a stencil printer or dot
5. Follow solder paste and vendor’s recommendations
6. Packages have been qualified to withstand a peak tem-
7. Clean off flux per vendor’s recommendations.
8. Clean the module with Acetone. Rinse with alcohol.
from topside if using a vacuum collet.
see recommended solder reflow profile. Conductive
epoxy is not recommended. Hand soldering is not
recommended.
placement. The volume of solder paste will be depen-
dent on PCB and component layout and should be
controlled to ensure consistent mechanical and electri-
cal performance. Excessive solder will degrade RF performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room tem-
perature to the pre-heat temp to avoid damage due to
thermal shock.
perature of 260qC for 20 to 40 sec. Verify that the profile
will not expose device beyond these limits.
Allow the module to dry before testing.