VLMY31J1K2-GS18 Vishay, VLMY31J1K2-GS18 Datasheet - Page 5

• Manufacturer Part Number: VLMY31J1K2-GS18
• Description: SMD-LED YELLOW PLCC2-e3
• Manufacturer: Vishay

Specifications of VLMY31J1K2-GS18

• Led Size: 3 mm x 2.8 mm
• Illumination Color: Yellow
• Lens Color/style: Clear
• Operating Voltage: 2.1 V
• Wavelength: 588 nm
• Luminous Intensity: 4.5 mcd to 11.2 mcd
• Mounting Style: SMD/SMT
• Operating Current: 10 mA
• Package / Case: PLCC-2
• Viewing Angle: 60 deg
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: VLMY31J1K2-GS08

METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM.3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
IEC 40 (CO) 564) for automatic component insertion.
The blister tape is a plastic strip with impressed
component cavities, covered by a top tape.
TAPING OF VLM.3...
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
Document Number 81326
Rev. 1.3, 22-Mar-11
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
Adhesive tape
1.6
1.4
Figure 9. Tape Dimensions in mm for PLCC-2
Figure 10. Reel Dimensions - GS08
4.1
3.9
Component cavity
3.5
3.1
2.05
1.95
180
178
4.5
3.5
4.1
3.9
120°
2.5
1.5
1.85
1.65
3.6
3.4
5.75
5.25
For technical support, please contact:
Blister tape
14.4 max.
8.3
7.7
13.00
12.75
This datasheet is subject to change without notice.
0.25
2.2
2.0
10.0
9.0
94 8668
94 8670
94 8665
63.5
60.5
4.0
3.6
DIN
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
SOLDERING PROFILE
Figure 13. Double Wave Soldering of Opto Devices (all Packages)
Figure 12. Vishay Lead (Pb)-free Reflow Soldering Profile
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Identification
Label:
Vishay
type
group
tape code
production
code
quantity
948626-1
250
200
150
100
300
50
19885
0
0
100
300
250
200
150
50
255 °C
240 °C
217 °C
0
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
max. ramp up 3 °C/s
Figure 11. Reel Dimensions - GS18
0
first wave
ca. 200 K/s
50
100 °C
to 130 °C
235 °C
to 260 °C
Preconditioning acc. to JEDEC level 2a
TTW Soldering (acc. to CECC00802)
max. 120 s
(acc. to J-STD-020)
50
forced cooling
100
5 s
Vishay Semiconductors
2 K/s
321
329
100
Time (s)
4.5
3.5
150
Time (s)
second
wave
120°
2.5
1.5
max. ramp down 6 °C/s
dotted line: process limits
ca. 2 K/s
max. 100 s
150
200
max. 30 s
www.vishay.com/doc?91000
max. 2 cycles allowed
full line: typical
lead temperature
14.4 max.
ca. 5 K/s
13.00
12.75
VLMY31..
max. 260 °C
250
200
245 °C
www.vishay.com
10.4
8.4
18857
62.5
60.0
300
250
5