VLMPG31L1M2-GS08 Vishay, VLMPG31L1M2-GS08 Datasheet - Page 5

• Manufacturer Part Number: VLMPG31L1M2-GS08
• Description: SMD-LED PUREGREEN PLCC2-e3
• Manufacturer: Vishay

Specifications of VLMPG31L1M2-GS08

• Led Size: 3 mm x 2.8 mm
• Illumination Color: Pure Green
• Lens Color/style: Non-Diffused
• Operating Voltage: 2 V
• Wavelength: 558 nm
• Luminous Intensity: 11.2 mcd to 28 mcd
• Mounting Style: SMD/SMT
• Peak Wavelength: 565 nm
• Package / Case: PLCC-2
• Viewing Angle: 60 deg
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: VLMPG31L1M2-GS18

METHOD OF TAPING/POLARITY AND TAPE
AND REEL
SMD LED (VLM3 - SERIES)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component
insertion. The blister tape is a plastic strip with
impressed component cavities, covered by a top tape.
TAPING OF VLM.3..
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
Document Number 81653
Rev. 1.1, 23-Feb-11
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
Adhesive tape
1.6
1.4
Figure 6. Tape Dimensions in mm for PLCC-2
Figure 7. Reel Dimensions - GS08
4.1
3.9
Component cavity
3.5
3.1
2.05
1.95
180
178
4.1
3.9
4.5
3.5
120°
2.5
1.5
1.85
1.65
3.6
3.4
5.75
5.25
For technical support, please contact:
Blister tape
14.4 max.
8.3
7.7
13.00
12.75
0.25
2.2
2.0
10.0
9.0
94 8668
94 8670
94 8665
63.5
60.5
4.0
3.6
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
SOLDERING PROFILE
Figure 10. Double Wave Soldering of Opto Devices (all Packages)
250
200
150
100
300
50
948626-1
19885
Figure 9. Vishay Lead (Pb)-free Reflow Soldering Profile
0
[e-mail]
0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
100
250
200
150
300
240 °C
217 °C
255 °C
50
0
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
max. ramp up 3 °C/s
0
first wave
ca. 200 K/s
50
100 °C
to 130 °C
235 °C
to 260 °C
Figure 8. Reel Dimensions - GS18
Preconditioning acc. to JEDEC level 2a
TTW Soldering (acc. to CECC00802)
max. 120 s
50
forced cooling
5 s
(acc. to J-STD-020)
2 K/s
100
Vishay Semiconductors
321
329
100
Time (s)
second
Time (s)
wave
4.5
3.5
150
VLMPG31L1M2
dotted line: process limits
120°
2.5
1.5
ca. 2 K/s
150
max. ramp down 6 °C/s
full line: typical
lead temperature
max. 100 s
200
ca. 5 K/s
max. 30 s
max. 2 cycles allowed
14.4 max.
200
13.00
12.75
www.vishay.com
10.4
max. 260 °C
250
8.4
245 °C
250
18857
62.5
60.0
300
5