HSMC-A401-U80M1 Avago Technologies US Inc., HSMC-A401-U80M1 Datasheet - Page 7
HSMC-A401-U80M1
Manufacturer Part Number
HSMC-A401-U80M1
Description
PLCC4,PWR,T/Mt,120VA,AlInGaP,Red
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HSMA-A401-U80M1.pdf
(10 pages)
Specifications of HSMC-A401-U80M1
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
7
Figure 9a. Recommended SnPb reflow soldering profile
Figure 10. Recommended wave soldering profile
Figure 11. Recommended Pick and Place Nozzle Size for InGaN Family
250
200
150
100
50
30
100-150°C
0
3°C/SEC. MAX.
D
120 SEC. MAX.
10
20 SEC. MAX.
3°C/SEC.
240°C MAX.
MAX.
FLUXING
20
PREHEAT
TIME
TURBULENT WAVE
60-150 SEC.
30
Note: Diameter "D" should
be smaller than 2.2mm
40
TIME – SECONDS
50
183°C
–6°C/SEC.
60
MAX.
70
LAMINAR WAVE
HOT AIR KNIFE
80
Figure 9b. Recommended Pb-free reflow soldering profile.
Note: For detailed information on reflow soldering of Avago
surface mount LEDs, refer to Avago Application Note AN 1060
Surface Mounting SMT LED Indicator Components.
90
217 °C
125 °C ± 25 °C
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
3 °C/SEC. MAX.
MAX. 120 SEC.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
255 °C
+5 °C
TIME
-0 °C
10 to 20 SEC.
60 to 150 SEC.
6 °C/SEC. MAX.