AMMP-6522-BLKG Avago Technologies US Inc., AMMP-6522-BLKG Datasheet - Page 8

• Manufacturer Part Number: AMMP-6522-BLKG
• Description: LNA IR Mixer 6-22GHz Package
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMP-6522-BLKG

• Current - Supply: 75mA
• Frequency: 7GHz ~ 20GHz
• Gain: 13dB
• Noise Figure: 2.6dB
• Package / Case: 8-SMD
• Test Frequency: 8GHz
• Voltage - Supply: 3 V ~ 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Rf Type: -
• P1db: -
• Lead Free Status / Rohs Status: Compliant

Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder
x Apply solder paste using a stencil printer or dot place-
x Follow solder paste and vendor’s recommendations
x Packages have been qualified to withstand a peak
Figure 22. Suggested lead-free Reflow Profile for SnAgCu solder paste
AMMP-6522 Part Number Ordering Information
Part Number
AMMP-6522-BLKG
AMMP-6522-TR1G
AMMP-6522-TR2G
8
paste. Please see recommended solder reflow profile.
Neither Conductive epoxy or hand soldering is
recommended.
ment. The volume of solder paste will be dependent
on PCB and component layout and should be con-
trolled to ensure consistent mechanical and electrical
performance.
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room temper-
ature to the pre-heat temp. to avoid damage due to
thermal shock.
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
300
250
200
150
100
50
0
0
RAMP 1
50
PREHEAT
Devices per Container Container
100
RAMP 2
PEAK = 250 ± 5°C
TIME (SECONDS)
100
500
10
150
REFLOW
MELTING POINT = 218°C
200
Antistatic bag
7” Reel
7” Reel
COOLING
250
300
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 21. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB
pad. Reducing stencil opening can potentially gener-
ate more voids underneath. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads. Considering
the fact that solder paste thickness will directly affect the
quality of the solder joint, a good choice is to use a laser
cut stencil composed of 0.127mm (5 mils) thick stainless
steel which is capable of producing the required fine
stencil outline.
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 22. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 1 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.