AMMC-6333-W50 Avago Technologies US Inc., AMMC-6333-W50 Datasheet - Page 11

• Manufacturer Part Number: AMMC-6333-W50
• Description: 17-33 GHz Driver Amplifier
• Manufacturer: Avago Technologies US Inc.

Specifications of AMMC-6333-W50

• Function: Amplifier
• Number Of Channels: 1
• Frequency (max): 33GHz
• Power Supply Requirement: Single
• Single Supply Voltage (max): 5.5V
• Package Type: Chip
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Assembly Techniques
The chip should be attached directly to the ground plane
using electrically conductive epoxy (Note 1). For conduc-
tive epoxy, the amount should be just enough to provide
a thin fillet around the bottom perimeter of the die. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment. Caution
should be taken to not exceed the Absolute Maximum
Rating for assembly temperature and time.
Thermo-sonic wedge bonding is the preferred method
for wire attachment to the bond pads. The RF connections
1300
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
Figure 19. Die dimensions
Ordering Information:
AMMC-6333-W10 = 10 devices per tray
AMMC-6333-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site:
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved.
AV02-1446EN - November 12, 2009
650
0
RF_IN
0 120
0 120
GND
GND
540
VG
935
945
VD
VD
www.avagotech.com
should be kept as short as possible to minimize induc-
tance. Double-bonding with 0.7mil gold wire is recom-
mended. The recommended wire bonding stage temper-
ature is 150±2°C.
The chip is 100μm thick and should be handled with care.
This chip has exposed air bridges on the top surface.
Handle at the edges or with a custom collet, (do not pick
up die with vacuum on die center).
This MMIC is static sensitive and ESD handling precau-
tions should be taken.
DET_O
DET_R
2400 2500
2400 2500
RF_OUT
1300
650
0