TLP260J Toshiba, TLP260J Datasheet

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TLP260J

Manufacturer Part Number
TLP260J
Description
OPTOCOUPLER, TRIAC O/P
Manufacturer
Toshiba
Series
-r
Datasheets

Specifications of TLP260J

No. Of Channels
1
Input Current
20mA
Output Voltage
600V
Opto Case Style
MFSOP
No. Of Pins
4
Approval Bodies
UL, VDE
Operating Temperature Range
-40°C To +100°C
Optocoupler Type
RoHS Compliant
Isolation Voltage
3kV
Optocoupler Output Type
Phototriac
Rohs Compliant
Yes
Voltage - Isolation
3000Vrms
Number Of Channels
1
Voltage - Off State
600V
Output Type
AC, Triac, Standard
Current - Gate Trigger (igt) (max)
10mA
Current - Hold (ih)
1mA
Current - Dc Forward (if)
20mA
Current - Output / Channel
70mA
Mounting Type
Surface Mount
Package / Case
4-SOP
Lead Free Status / Rohs Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TLP260J
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
Part Number:
TLP260J(TPL)
Manufacturer:
TOSHIBA
Quantity:
1 118
Part Number:
TLP260J(TPRPF)
Manufacturer:
Toshiba
Quantity:
132 579
2011-3
PRODUCT GUIDE
Photocouplers and Photorelays
S E M I C O N D U C T O R
h t t p : / / w w w . s e m i c o n . t o s h i b a . c o . j p / e n g

Related parts for TLP260J

TLP260J Summary of contents

Page 1

PRODUCT GUIDE Photocouplers and Photorelays ...

Page 2

... IEC380/VDE0806, IEC60950/EN60950 and IEC60065/EN60065. Small-Package Products Toshiba offers a wide variety of photocouplers in a small package to meet the space-saving requirement of increasingly smaller and thinner end products. Packaging options include mini-flat packages (MFSOPs) and half-pitch (1.27 mm) mini-flat SOP packages ...

Page 3

... TLP2368 34 TLP2403 34 TLP2404 TLP2405 34 34 TLP2408 34 TLP2409 ( 34 TLP2409 IGM 34 TLP2418 34 TLP2451 28 TLP2451A TLP2466 28 28 TLP2467 TLP2468 28 28 TLP2530 28 TLP2531 28 TLP2601 28 TLP260J TLP261J 28 27 TLP2630 TLP2631 28 28 TLP2766 28 TLP2767 28 TLP2768 28 TLP280 TLP280-4 14,38 11,38 TLP281 TLP281 TLP284 36 TLP284-4 36 TLP285 29 TLP285-4 TLP290 TLP291-4 ( ...

Page 4

Product Index Part Number Package TLP3212 SSOP4 MOSFET (Photorelay) SSOP4 MOSFET (Photorelay) TLP3213 TLP3214 SSOP4 MOSFET (Photorelay) SSOP4 TLP3215 MOSFET (Photorelay) TLP3216 SSOP4 MOSFET (Photorelay) SSOP4 TLP3217 MOSFET (Photorelay) TLP3218 SSOP4 MOSFET (Photorelay) TLP3219 SSOP4 MOSFET (Photorelay) SSOP4 MOSFET ...

Page 5

... New Products Small Surface-Mount IC-Output Photocouplers in the SO8 Package Toshiba is expanding its portfolio of IC-output photocouplers in the small and thin SO8 package. To meet customer needs, Toshiba has released photocouplers featuring various data rates, dual-channel configurations and power device drivers. Data rate Part Number (typ ...

Page 6

... TLP2108 2-ch IC-Output Photocouplers for IPM Drive Applications Toshiba offers IC-output photocouplers ideal for IPM drive applications. Compared to the conventional TLP114A (IGM), these IC-output photocouplers provide shorter propagation delay times, a wider operating temperature range and digital output. Thus, they help to simplify system design and improve system performance ...

Page 7

... High-ION Photorelays: TLP354x Series (Under Development) Toshiba is now developing the TLP354x Series in the DIP6 package targeting applications that deal with relatively large current. Housed in the DIP6 package, the TLP354x photorelays allow B and C connections, enabling the switching of 8-A, 7-A, 6-A and 4-A dc current respectively ...

Page 8

... General-Purpose Photorelays Certified for Reinforced Insulation: TLP220 Series and TLP221A (Under Development) Toshiba is now developing the TLP220 Series and the TLP221 targeting factory equipment applications, and wattmeter and smart meter applications for the monitoring of electrical energy consumption. These photorelays meet the requirements for high isolation voltage between input and output, as well as for international safety standards certification ...

Page 9

Photocoupler Product Tree Photocoupler Product Tree Package DIP4 DIP6 DIP8 DIP16 SO8 SOP4 2.54SOP4 2.54SOP6 Transistor-Output Photorelays Photorelays Thyristor- and Triac-Output Triac Output Thyristor Output ZC DIP4 DIP6 DIP8 DIP16 ● ≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness SDIP6 ...

Page 10

... Vrms High I 5000 Vrms F Darlington 2500 Vrms 2500 Vrms High V CEO 5000 Vrms *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. SOP16 SOP16 SO6 SO16 MFSOP6 Quad Single Quad Single ...

Page 11

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 12

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. (3) CTR (%) ...

Page 13

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. (3) CTR (%) ...

Page 14

... Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. Note 5: For safety standard compliance criteria including the operating temperature conditions, please contact your nearest Toshiba representative. ...

Page 15

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 16

... For the latest information, please contact your nearest Toshiba sales representative. Note 3: Some CTR ranks may be limited in production quantities. For details, please contact your nearest Toshiba sales representative. Note 4: Product manufactured by Toshiba Semiconductor (Thailand) Co.,Ltd. [TST] is recommended. See page 38 for detail. Japan product is non-promotional item. (3) ...

Page 17

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 18

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 19

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 20

... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 21

... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 22

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 23

... TLP701A* ± 0.6 A (max) TLP701H* TLP705A* TLP700 ± 2.0 A (max) TLP700H* ± 2.5 A (max) *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Propagation Delay Time Output Form/CTR Features (Max) 800 ns 25% ...

Page 24

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 25

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 26

... Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. SSOP4 SO6 2.54SOP4 2.54SOP6 TLP3230 TLP3130 TLP3250 TLP3131 TLP3231 TLP3203 TLP3100 TLP3213 TLP3113 TLP3216 ...

Page 27

... OFF * Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 28

... OFF Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 29

... Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 30

... Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. ...

Page 31

... SEMKO-approved Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 32

... SEMKO-approved Note 1: The EN60747-5-2 safety standard for compact packages is different from that for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜ ...

Page 33

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. R (Max ...

Page 34

... TLP160G TLP161G 400 V 5000 Vrms TLP161J TLP160J TLP165J TLP163J 2500 Vrms TLP166J TLP260J TLP261J 3000 Vrms 600 V 3750 Vrms TLP168J 4000 Vrms 5000 Vrms 800 V 5000 Vrms *Under development. Specifications subject to change without notice. For the latest information, please contact your nearest Toshiba sales representative. ...

Page 35

... Triac-Output Photocouplers for Solid State Relays ( SSRs ) (Continued) Pin Configuration Part Number 6 4 Mini-flat TLP260J MFSOP6 Non-zero cross Mini-flat TLP261J ZC MFSOP6 Zero cross 1 3 Triac-Output Photocouplers for Office Equipment Part Number Pin Configuration 4 3 TLP360J DIP4 TLP360JF Non-zero cross TLP361J DIP4 ...

Page 36

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

Page 37

... Note 2: BSI and IEC: : Approved (supplementary or basic insulation) EN 60065- and IEC 60065-approved, EN 60950- and IEC 60950-approved TÜV and VDE: : Approved : Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. I (Max) V (Max) ...

Page 38

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. MFSOP6 ...

Page 39

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. BVs ...

Page 40

... Design which meets safety standard/approval pending as of January 2011 EN 60747-5-2-approved with option For the latest information, please contact your nearest Toshiba sales representative. Some of the photocouplers with triac output are also manufactured by Toshiba Semiconductor Thailand Co.,Ltd. For detailed information, please contact your nearest Toshiba sales representative. Off-State ...

Page 41

... Note: The length of part names is limited to 18 characters. Longer names are abbreviated by omitting the “-“ character and/or using shorthand symbols. However, be sure to give full part names when you have any inquiries. For details, please contact your nearest Toshiba sales representative. ...

Page 42

Package Information 1 Lead Form Options for DIP Packages The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The electrical characteristics are identical, regardless of these options. Lead Form ...

Page 43

Package Dimensions ( 4-Pin DIP ) Standard DIP4 4.58 ± 0.25 7.62 ± 0.25 1.2 ± 0.15 0.5 ± 0.1 7.85 to 8.80 2.54 ± 0.25 DIP4 (LF2 10.16 ± 0.25 ...

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Package Information 2 Package Dimensions ( 6-Pin DIP ) Standard DIP6 7.12 ± 0.25 0.5 ± 0.1 1.2 ± 0.15 2.54 ± 0.25 DIP6 (LF2 7.12 ± ...

Page 45

Package Dimensions ( 8-Pin DIP ) Standard DIP8 9.66 ± 0.25 1.2 ± 0.15 0.5 ± 0.1 2.54 ± 0.25 DIP8 (LF2 9.66 ...

Page 46

Package Information 2 Package Dimensions ( Other DIP Packages ) 5-pin DIP6 7.12 ± 0.25 0.5 ± 0.1 1.2 ± 0.15 2.54 ± 0.25 5-pin DIP (with Pin 5 Cut ...

Page 47

Package Dimensions ( Surface Mount ) SDIP6 4.58 ± 0. 7.62 ± 0.25 1.27 ± 0.2 1.25 ± 0.2 0.4 ± 0.1 9.7 ± 0.3 4-pin MFSOP6 7.0 ± ...

Page 48

Package Information 2 Package Dimensions ( Surface Mount ) 2.54SOP4 3.9 ± 0.25 0.4 ± 0.1 2.54 ± 0.25 2.54SOP8 9.4 ± 0.25 2.54 ± 0.25 0.4 ...

Page 49

... Transistor-output photocouplers are ranked according to their CTR ranges, whereas thyristor-output and triac-output photocouplers are ranked according to their maximum I Note that the rank classifications differ from product to product. For details, please refer to the relevant technical datasheets. 1. CTR Rank Name and Rank Marking Available CTR Rank Selection ( ●: Available, ▲: Contact Toshiba) Part Number None GB ...

Page 50

Package Information 2. LED Trigger Current (I ) Ranking and Marking FT Rank Name I None I FT7 7 mA max I FT5 5 mA max I FT2 2 mA max 3. Marking Examples (a) 4-pin mini-flat 1-channel type ...

Page 51

Packing Information 1 Photocoupler Magazine Packing Specifications Magazine Dimensions Device Package Pin Count Quantities per Magazine Quantity (pcs Packing Dimensions A Number of Magazines Standard DIP DIPs with LF1, LF2, LF4 and LF5 Lead ...

Page 52

Packing Information Unit: mm SO6 10.5 4.8 Magazine Dimensions 4.7 Length = 555 Thickness = 0.5 Package 5 Device Pin Count (SO6) Quantities per Magazine Quantity (pcs) 125 B Packing Dimensions Package SO6 MFSOP6 SO8 Photocoupler Package Type MFSOP6 ...

Page 53

Tape-and-Reel Specifications The tape specifications differ for photocouplers manufactured in Thailand. 1. Embossed Tape Specifications for Surface-Mount Lead Form Options Photocoupler Package Types MFSOP6, SO6 SO8 SOP4 SOP16 2.54SOP4 2.54SOP6 2.54SOP8 SSOP4 SDIP6 DIP(LF1, LF5) DIP(LF4) 2. Tape Dimensions ...

Page 54

Packing Information 3. Reel Dimensions U E ø380 mm Photocoupler MFSOP, SO6 SO8 SOP4 Package Type ( TPL ) , ( TPR ) ( Tape Option ø380 ± ...

Page 55

... Labels with “ Please contact your TOSHIBA sales representative for details as to environmental matters such as the The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment ...

Page 56

Board Assembly 1 Example Land Patterns Below are the example land patterns for surface-mount packages. Mini-flat and SOP couplers 0.8 2.54 MFSOP6 (4-Pin) [e.g., TLP181] MFSOP6 (5-Pin) [e.g., TLP114A] 2.54SOP4 [e.g., TLP197G] SO6 (4-Pin) [e.g., TLP265J] 1.27 1.27 1.27 ...

Page 57

... Example of temperature profile of lead (Pb) solder c. Example of temperature profile of lead (Pb)-free solder The profile below shows only the typical temperature profile and conditions, which might not apply to all Toshiba photocouplers. Temperature profiles and conditions may differ from product to product. Refer to the relevant technical datasheets and databooks when mounting a device. (° ...

Page 58

... Projected Operating Life Based on LED Light Output Degradation Toshiba photocouplers use one of four types of LEDs and a projection of the operating life has been made for each LED. The table on page 57 shows the types of LED used in photocouplers and the figures on pages show projections of long-term light output performance and operating life ...

Page 59

... TLP797 Series 1 TLP572 1 TLP798GA TLP590B TLP2066 1 3 TLP591B TLP2200 2 3 TLP592 Series TLP2530 2 1 TLP2531 2 TLP594 Series 1 TLP597 Series TLP2601 TLP598 Series 3 TLP260J 59 LED Photocouplers LED 1 TLP2630 2 TLP2631 TLP3022(S) Series 1 1 TLP3042(S) Series 1 TLP3063(S) Series TLP31xx Series 1 TLP32xx Series 1 1 TLP3230 1 ...

Page 60

Device Degradation GaAs LED Projected Light Output Degradation Data 1 Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions ...

Page 61

GaA As (SH) LED Projected Light Output Degradation Data Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions ...

Page 62

Device Degradation GaA As (DH) LED Projected Light Output Degradation Data 3 Test conditions mA 40°C F 140 120 100 100 1000 Test time (h) Test conditions: ...

Page 63

... GaA As (MQW) LED Projected Light Output Degradation and Operating Life Data Toshiba is now preparing the light output degradation and operating life data for GaA As LEDs. These data are available for individual LEDs. Ask your local Toshiba sales representative ...

Page 64

Device Degradation Reading the Projected LED Operating Life Graph For example, let's calculate the operating life of the GaAs LED, based on the data shown on page 60. Here is an example of how to read an operating life, ...

Page 65

... Vpk 565 Vpk 565 Vpk 6000 Vpk 6000 Vpk 4000 Vpk 4000 Vpk TLP2105 TLP2108 TLP2166A TLP2116 TLP2117 TLP180 TLP127 TLP181 TLP260J TLP160G TLP261J TLP160J TLP161G TLP161J 65 Coupling Medium (Window) Package (Body) Lead LED Chip SO8 2.54SOP DIP (2 ch) ...

Page 66

... Devices Triac/Thyrsitor Output The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest information, please contact your nearest Toshiba sales representative. (DIN EN60747-5-2) (Continued) Single-Molded Packages Coupling Medium ...

Page 67

Photocoupler Application Circuit Examples 1 Digital Interface Applications High Speed TLP118, TLP2601 7 390 Ω LSTTL Low Input Current Drive TLP553 0 4.7 kΩ kΩ CMOS ...

Page 68

Photocoupler Application Circuit Examples 2 Inverter and AC-DC Servo Applications [ Photo-IC couplers: high-speed base/gate drive applications ] GTR Direct Drive TLP109 / TLP2409 IGBT / TLP550 / TLP559 Power MOS Direct Drive TLP759 High-Speed (Numerical control, Robotics) Driving ...

Page 69

Driving the Gate of a 50-A-Class IGBT Module TLP350 0.1 μ 390 Ω LSTTL Driving the Gate of a 400-A-Class IGBT Module TLP351/ TLP2541 8 1 0.1 μF ...

Page 70

Photocoupler Application Circuit Examples 3 Home Appliance Applications Electric Oven/Grills Magnetron Thermo-Switch Grill Heater Oven- TLP560G Cavity Lamp 120 Vac 50/60 Hz Door-Detector Circuit Weight Sensor Gas Sensor Refrigerator Block Diagram Panel Input Door Switch Temperature Sensor Door-Open Monitor ...

Page 71

Automatic Washing Machines M Drain Valve Water Supply Valve 100 Vac Fan Heaters (1)Block Diagram Panel Main Switch Adjustment Switches Display Speaker Room Temperature Sensor Preheat Sensor Earthquake Sensor TLP560G ...

Page 72

Photocoupler Application Circuit Examples 4 Home Appliance Applications (2)Waveform Examples 1. Example of Operating Waveform for Burner Motor Top: waveforms Medium: Bottom: Horizontal: Inverter Air Conditioners Remote Control Panel Microcontroller for Indoor Control Panel Unit Room Temperature Sensor Temperature ...

Page 73

Programmable Controller Applications DC Output for Sequencers TLP127 /TLP627 TLP225A /TLP222A Input for Sequencers 1 2 Limit Switches ● Thermostats ● Transducer ● DC-AC 3 Inputs 4 COMMON ...

Page 74

... TLP161G/ TLP561G/ TLP3042 ( S ) TLP166J / TLP561J / TLP3062 ( TLP3082 ( TLP3782 ( Lamp Load (1-A tungsten lamp) Top: Medium: Waveforms Bottom: Non-Zero Crossing Phototriac Output: TLP560G/TLP560J and Mini-Flat TLP160G/TLP260J TLP160G / TLP560G / TLP3022 ( S ) TLP260J / TLP560J / TLP3052 ( Lamp Load (1-A tungsten lamp) Top: Waveforms Medium: V Bottom TNR ...

Page 75

... TLP748J Note 1: EN60747-approved with option (D4) Note 2: The EN60747-5-2 safety standard for compact packages is different from those for standard DIP packages. Since the mini-flat package is a compact package, please contact your nearest Toshiba sales representative for more details. *: Double protection Filter Switching ...

Page 76

Photocoupler Application Circuit Examples 8 Push-Button Telephone Application A variety of photocouplers are used to isolate between telephone lines (L1 and L2) and a CPU. Line Detector TLP629 TLP320 Application Package Type DIP4 TLP781 Ring ...

Page 77

Photovoltaic Coupler Applications TLP190B TLP590B TLP191B TLP591B Transformerless AC-DC converter TLP590B x n 100 Aac 10 Photorelays for Tester Application TLP3120 /TLP3122 /TLP3542 Power Source Timing Generator CPU Pattern Generator 11 Photorelay ( MOSFET Output ) Application L 1 ...

Page 78

... TLP280 TLP281 Half-Pitch Mini-Flat Coupler 13 Competitor Part Number Cross Reference Search The Toshiba Semiconductor webpage at http://www.semicon.toshiba.co.jp/eng/product/opto/selection/coupler/xref/index.html offers a cross reference search tool for photocouplers and photorelays. No need for output snubber circuit ● ● No need for reverse-blocking diode in input side Off-Hook Relay ...

Page 79

... TLP281 PC3H7 TLP797GA PC3H3 TLP280 TLP797GA PC3H21 TLP525G TLP197GA PC410 TLP118 TLP597A TLP351 PC942 TLP797J TLP351 PC923 TLP197D S2S3 TLP260J TLP4592G S2S4 TLP161J TLP4592G PR36MF11NSZ TLP3506 TLP4597G PR36MF12NSZ TLP3506 TLP4197G TLP3051 ( S ) S21MD3V TLP222G-2 TLP3526 S201D01 TLP202G S201D02 TLP3527 TLP222A-2 Fairchild TLP227GA-2 ...

Page 80

... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise ...

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