HLMP-AM65-140DD Avago Technologies US Inc., HLMP-AM65-140DD Datasheet - Page 9

• Manufacturer Part Number: HLMP-AM65-140DD
• Description: LED, 5MM, GREEN, 6050MCD, 525NM
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-AM65-140DD

• Bulb Size: T-1 3/4 (5mm)
• Led Color: Green
• Luminous Intensity: 6.05cd
• Viewing Angle: 70°
• Forward Current If: 20mA
• Forward Voltage: 3.2V
• Led Mounting: Through Hole
• Lens Shape: Oval
• Wavelength Typ: 540nm
• Color: Green
• Millicandela Rating: 4475mcd
• Current - Test: 20mA
• Wavelength - Dominant: 525nm
• Wavelength - Peak: 516nm
• Voltage - Forward (vf) Typ: 3.2V
• Lens Type: Diffused, Green Tinted
• Lens Style/size: Oval, 5mm
• Package / Case: Radial - 2 Lead
• Height: 8.70mm
• Mounting Type: Through Hole
• Resistance Tolerance: 525nm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Precautions:
Lead Forming:
 The leads of an LED lamp may be preformed or cut to
 For better control, it is recommended to use proper
 If manual lead cutting is necessary, cut the leads after
Soldering and Handling:
 Care must be taken during PCB assembly and soldering
 LED component may be eff ectively hand soldered
 ESD precaution must be properly applied on the
 Recommended soldering condition:
 Wave soldering parameters must be set and maintained
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length prior to insertion and soldering on PC board.
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
process to prevent damage to the LED component.
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Note:
1. Above conditions refers to measurement with thermocouple
2. It is recommended to use only bottom preheaters in order to
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profi le to ensure that it is always conforming
to recommended soldering conditions.
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
mounted at the bottom of PCB.
reduce thermal stress experienced by LED.
1.59mm
Wave
Soldering
105 °C Max.
60 sec Max
260 °C Max.
5 sec Max.
[1, 2]
Manual Solder
Dipping
-
-
260 °C Max.
5 sec Max
Note:
1. PCB with diff erent size and design (component density) will have
2. Avago Technologies’ AllnGaP high brightness LED are using high
Avago Technologies LED confi guration
 Any alignment fi xture that is being applied during
 At elevated temperature, LED is more susceptible to
 If PCB board contains both through hole (TH) LED and
 Recommended PC board plated through holes (PTH)
 Over-sizing the PTH can lead to twisted LED after
diff erent heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profi le again before loading a new type of PCB.
effi ciency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260°C and the
solder contact time does not exceeding 5sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
wave soldering should be loosely fi tted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fi xture or pallet.
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using refl ow soldering prior to insertion the TH LED.
size for LED component leads.
clinching. On the other hand under sizing the PTH can
cause diffi culty inserting the TH LED.
Refer to Application Note 5334 for more information about soldering
and handling of high brightness TH LED lamps.
LED component
lead size
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
CATHODE
InGaN Device
Diagonal
0.636 mm
(0.025 inch)
0.707 mm
(0.028 inch)
ANDOE
AlInGaP Device
Plated through
hole diameter
0.98 to 1.08 mm
(0.039 to 0.043 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)