HLMP-C423 Avago Technologies US Inc., HLMP-C423 Datasheet - Page 10

• Manufacturer Part Number: HLMP-C423
• Description: LED, 5MM, ORANGE, 170MCD
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-C423

• Bulb Size: 5mm
• Led Color: Orange
• Luminous Intensity: 170mcd
• Viewing Angle: 25°
• Forward Current If: 20mA
• Forward Voltage: 1.9V
• Led Mounting: Through Hole
• Lens Shape: Round
• Leaded Process Compatible: Yes
• Color: Orange
• Millicandela Rating: 170mcd
• Current - Test: 20mA
• Wavelength - Dominant: 602nm
• Wavelength - Peak: 600nm
• Voltage - Forward (vf) Typ: 1.9V
• Lens Type: Clear, Orange Tinted
• Lens Style/size: Round, 5mm, T-1 3/4
• Package / Case: Radial - 2 Lead
• Height: 8.71mm
• Mounting Type: Through Hole
• Resistance Tolerance: 602nm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• It is recommended that tooling made to precisely form
Soldering Conditions
• Care must be taken during PCB assembly and soldering
• The closest LED is allowed to solder on board is 1.59
• Recommended soldering conditions:
Figure 8. Recommended wave soldering profile.
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4251EN
AV02-1561EN - October 13, 2008
length prior to insertion and soldering into PC board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
and cut the leads to length rather than rely upon hand
operation.
process to prevent damage to LED component.
mm below the body (encapsulant epoxy) for those
parts without standoff.
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
250
200
150
100
50
30
0
10
FLUXING
TURBULENT WAVE
PREHEAT
20
30
TIME – SECONDS
40
Wave Soldering
105°C Max.
30 sec Max.
250°C Max.
3 sec Max.
50
60
70
LAMINAR WAVE
HOT AIR KNIFE
80
90 100
Manual Solder
Dipping
–
–
260°C Max.
5 sec Max.
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
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• Wave soldering parameter must be set and maintained
• If necessary, use fixture to hold the LED component
• Proper handling is imperative to avoid excessive ther-
• Special attention must be given to board fabrication,
• Recommended PC board plated through hole sizes for
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
in proper orientation with respect to the PCB during
soldering process.
mal stresses to LED components when heated. There-
fore, the soldered PCB must be allowed to cool to room
temperature, 25°C, before handling.
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
LED component leads:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Note:
Refer to application note AN1027 for more information on soldering
LED components.
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)