HLMP-1700-CD0FH Avago Technologies US Inc., HLMP-1700-CD0FH Datasheet - Page 9

• Manufacturer Part Number: HLMP-1700-CD0FH
• Description: LED, 3MM, RED, 2.1MCD, 626NM
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-1700-CD0FH

• Bulb Size: T-1 (3mm)
• Led Color: Red
• Luminous Intensity: 2.1mcd
• Viewing Angle: 50°
• Forward Current If: 2mA
• Forward Voltage: 1.7V
• Led Mounting: Through Hole
• Lens Shape: Dome
• Wavelength Typ: 626nm
• Color: Red
• Millicandela Rating: 2.65mcd
• Current - Test: 2mA
• Wavelength - Dominant: 626nm
• Wavelength - Peak: 635nm
• Voltage - Forward (vf) Typ: 1.7V
• Lens Type: Diffused, Red Tinted
• Lens Style/size: Round, 3mm, T-1
• Package / Case: Radial - 2 Lead
• Height: 4.70mm
• Mounting Type: Through Hole
• Resistance Tolerance: 626nm
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
Example of Wave Soldering Temperature Profile for TH LED
9
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
250
(1P) Item: Part Number
(V) Vendor ID:
200
150
100
50
0
Lamps Baby Label
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
QUANTITY: Packing Quantity
RoHS Compliant
e3
max temp 250C
70
max temp 250C
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.