HSMS-282R-TR1 Avago Technologies US Inc., HSMS-282R-TR1 Datasheet - Page 6

• Manufacturer Part Number: HSMS-282R-TR1
• Description: Diode
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-282R-TR1

• Series Resistance @ If: 12ohm
• Peak Reflow Compatible (260 C): No
• Reel Quantity: 3000
• Pin Configuration: Ring Quad
• Termination Type: SMD
• Breakdown Voltage Min: 15V
• Leaded Process Compatible: No
• Forward Voltage: 340mV
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

SMT Assembly
Reliable assembly of surface mount components is a com‑
plex process that involves many material, process, and
equipment factors, including: method of heating (e.g., IR
or vapor phase reflow, wave soldering, etc.) circuit board
material, conductor thickness and pattern, type of solder
alloy, and the thermal conductivity and thermal mass of
components. Components with a low mass, such as the
SOT package, will reach solder reflow temperatures faster
than those with a greater mass.
Avago’s SOT diodes have been qualified to the time‑
temperature profile shown in Figure 8. This profile is
representative of an IR reflow type of surface mount as‑
sembly process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place with
solder paste) passes through one or more preheat zones.
Part Number Ordering Information
x = 0, 2, 3, 4, 5, 8, B, C, E, F, K, L, M, N, P, R
For lead‑free option, the part number will have the
character "G" at the end, eg. HSMS‑280x‑TR2G for a
10,000 lead‑free reel.
6
Figure 8. Surface Mount Assembly Profile.
Part Number
HSMS‑280x‑TR2*
HSMS‑280x‑TR1*
HSMS‑280x‑BLK*
250
200
150
100
50
0
0
60
Preheat
No. of
Devices
10000
3000
100
Zone
120
TIME (seconds)
Container
13” Reel
7” Reel
antistatic bag
Reflow
Zone
180
Cool Down
Zone
The preheat zones increase the temperature of the board
and components to prevent thermal shock and begin
evaporating solvents from the solder paste. The reflow zone
briefly elevates the temperature sufficiently to produce a
reflow of the solder.
The rates of change of temperature for the ramp‑up and
cool‑down zones are chosen to be low enough to not
cause deformation of the board or damage to components
due to thermal shock. The maximum temperature in the
reflow zone (T
These parameters are typical for a surface mount assem‑
bly process for Avago diodes. As a general guideline, the
circuit board and components should be exposed only
to the minimum temperatures and times necessary to
achieve a uniform reflow of solder.
240
T
MAX
MAX
300
) should not exceed 235°C.