HSMS-2812-TR1 Avago Technologies US Inc., HSMS-2812-TR1 Datasheet - Page 6

no-image

HSMS-2812-TR1

Manufacturer Part Number
HSMS-2812-TR1
Description
Zener Diode
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HSMS-2812-TR1

Diode Type
Schottky - 1 Pair Series Connection
Voltage - Peak Reverse (max)
20V
Current - Max
1A
Capacitance @ Vr, F
1.2pF @ 0V, 1MHz
Resistance @ If, F
15 Ohm @ 5mA, 1MHz
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Power Dissipation (max)
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSMS-2812-TR1G
Manufacturer:
TI
Quantity:
14 500
Part Number:
HSMS-2812-TR1G
Manufacturer:
AVAGO
Quantity:
878
Part Number:
HSMS-2812-TR1G
Manufacturer:
AVAGO/安华高
Quantity:
20 000
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT
package, will reach solder reflow
temperatures faster than those
with a greater mass.
Agilent’s SOT diodes have been
qualified to the time-temperature
profile shown in Figure 8. This
profile is representative of an IR
reflow type of surface mount
assembly process.
Figure 8. Surface Mount Assembly Profile.
250
200
150
100
50
0
0
60
Preheat
Zone
120
TIME (seconds)
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporat-
ing solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
The rates of change of tempera-
ture for the ramp-up and cool-
down zones are chosen to be low
enough to not cause deformation
of the board or damage to compo-
nents due to thermal shock. The
maximum temperature in the
reflow zone (T
exceed 235°C.
Reflow
Zone
180
Cool Down
Zone
MAX
) should not
240
T
MAX
300
These parameters are typical for a
surface mount assembly process
for Agilent diodes. As a general
guideline, the circuit board and
components should be exposed
only to the minimum tempera-
tures and times necessary to
achieve a uniform reflow of
solder.
6

Related parts for HSMS-2812-TR1