BZT52C36-TP Micro Commercial Components (MCC), BZT52C36-TP Datasheet

BZT52C36-TP

Manufacturer Part Number

BZT52C36-TP

Description

500mW, 36V Zener, SOD-123 / 7" REEL

Manufacturer

Micro Commercial Components (MCC)

Datasheets

1.BZT52C5V1-TP.pdf (4 pages)

2.BZT52C39-TP.pdf (3 pages)

Specifications of BZT52C36-TP

Voltage - Zener (nom) (vz)

36V

Voltage - Forward (vf) (max) @ If

900mV @ 10mA

Current - Reverse Leakage @ Vr

100nA @ 25.2V

Power - Max

500mW

Impedance (max) (zzt)

90 Ohm

Mounting Type

Surface Mount

Package / Case

SOD-123

Operating Temperature

-65°C ~ 175°C

Zener Voltage

36 V

Voltage Tolerance

6 %

Voltage Temperature Coefficient

33.9 mV / C

Power Dissipation

500 mW

Maximum Reverse Leakage Current

0.1 uA

Maximum Zener Impedance

90 Ohms

Maximum Operating Temperature

+ 175 C

Mounting Style

SMD/SMT

Minimum Operating Temperature

- 65 C

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Tolerance

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

BZT52C36-TP
BZT52C36-TPMSTR

Current page: 1 of 3
Download datasheet (112Kb)

Revision: 8

Micro Commercial Components

Features

* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with

pad areas 25

Absolute Maximum Ratings

Electrical Characteristics

Absolute Maximum Ratings

Symbol

M C C

Planar Die Construction

500mW Power Dissipation on Ceramic PCB

General Purpose Medium Current

Ideally Suited for Automated Assembly Processes

Case Material: Molded Plastic. UL Flammability

designates RoHS Compliant. See ordering information)

Classification Rating 94V-0 and MSL Rating 1

Lead Free Finish/RoHS Compliant("P" Suffix

STG

thJA

Thermal Resistance Junction to

Ambient*

Maximum Forward Voltage

Power dissipation

Junction Temperature

Storage Temperature Range

=10mAdc)

Rating

www.mccsemi.com

omponents

20736 Marilla Street Chatsworth

!"#

$ % !"#

-65 to +175

Rating

305

500

0.9

1 of 3

Unit

DIM

.140

.100

.055

-----

.012

.006

-----

2.4 to 39 Volts

MIN

BZT52C2V4

Zener Diode

INCHES

BZT52C39

SUGGESTED SOLDER

SOD123

500 mW

PAD LAYOUT

THRU

MAX

0.048”

.152

.112

.071

.053

.031

-----

.006

.01

DIMENSIONS

0.093"

3.55

2.55

1.40

-----

0.30

0.15

-----

MIN

MAX

3.85

2.85

1.80

1.35

-----

.78

.25

.15

0.036”

2008/01/30

NOTE

Related parts for BZT52C36-TP

BZT52C36-TP Summary of contents

Page 1

Micro Commercial Components Features Planar Die Construction 500mW Power Dissipation on Ceramic PCB General Purpose Medium Current Ideally Suited for Automated Assembly Processes Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 and MSL Rating 1 Lead ...

Page 2

... BZT52C22 20.8 22 23.3 BZT52C24 22.8 24 25.6 BZT52C27 25.1 27 28.9 BZT52C30 28 30 BZT52C33 31 33 BZT52C36 34 36 BZT52C39 37 39 (1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25 mm (2) f=1KHz www.mccsemi.com Revision: 8 Maximum Zener Maximum Zener (2) Impedance Impedance Z (OHMS Max. ...

Page 3

Micro Commercial Components Ordering Information Device (Part Number)-TP Micro Commercial Components Corp product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp use of any product described ...

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