THAT340S14-U THAT Corporation, THAT340S14-U Datasheet - Page 4

• Manufacturer Part Number: THAT340S14-U
• Description: TRANSISTOR ARRAY, SMD, SO-14, 340
• Manufacturer: THAT Corporation

Specifications of THAT340S14-U

• Module Configuration: Dual
• Transistor Polarity: NPN / PNP
• Collector Emitter Voltage V(br)ceo: 40V
• Gain Bandwidth Ft Typ: 350MHz
• Dc Collector Current: 20mA
• Operating Temperature Range: 0°C To +70°C
• Dc Current Gain Hfe: 100
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Document 600041 Rev 02
PDIP and 14-pin surface mount (SOIC) packages.
Package dimensions are shown below.
lead-frames are copper, plated with successive layers of
nickel, palladium, and gold. This approach makes it
possible to solder these devices using lead-free and lead-
bearing solders.
Parameter
Through-hole package
Surface mount package
(1.52)
0.060
Thermal Resistance
Environmental Regulation Compliance
Thermal Resistance
Soldering Reflow Profile
Moisture Sensitivity Level
Environmental Regulation Compliance
Typ.
The THAT 300, 320 and 340 are available in 14-pin
The 300-series packages are entirely lead-free. The
1
Figure 4. Dual-In-Line Package Outline
(19.05±0.10)
0.750±0.004
(1.91)
0.075
0.10 Typ.
(2.54)
THAT Corporation; 45 Sumner Street; Milford, Massachusetts 01757-1656; USA
Tel: [phone]; Fax: [phone]; Web: www.thatcorp.com
0.125±0.004
(3.18±0.10)
(0.46)
0.018
Packaging and Soldering Information
Symbol
(6.35±0.10)
0.25±.004
MSL Above-referenced JEDEC soldering profile
θ
θ
Copyright © 2010, THAT Corporation. All rights reserved.
JA
JA
DIP package soldered to board
(7.62 ±0.5)
SO package soldered to board
0.30 ±0.02
(0.25)
0.010
Complies with January 27, 2003 RoHS requirements
Package Characteristics
See Fig. 4 for dimensions
See Fig. 5 for dimensions
Conditions
Page 4 of 5
compounds used in the 300-series contains any hazard-
ous substances as specified in the European Union's
Directive on the Restriction of the Use of Certain Hazard-
ous Substances in Electrical and Electronic Equipment
2002/95/EG of January 27, 2003. The surface-mount
package is suitable for use in a 100% tin solder process.
Neither the lead-frames nor the plastic mold
1
Figure 5. Surface-Mount Package Outline
0.344 (8.74)
(1.27)
0.050
0.018 (0.46)
Max
Typ
Max
JEDEC JESD22-A113-D (250 ºC)
THAT 300 Series Transistor Array ICs
Complies with RoHS requirements
14 Pin PDIP
14 Pin SOP
Typ
100
100
1
(3.99)
0.157
Max
(1.75)
0.069
Max
0.245
(6.2)
Max
(0.25)
0.010
Max
Units
ºC/W
ºC/W