FI-XPB30SL-HF10 JAE Electronics, FI-XPB30SL-HF10 Datasheet - Page 2

• Manufacturer Part Number: FI-XPB30SL-HF10
• Description: CONN RCPT 30POS R/A 1MM SMD
• Manufacturer: JAE Electronics
• Series: FI-XPr

Specifications of FI-XPB30SL-HF10

• Connector Type: Receptacle
• Contact Type: Non-Gender Specific
• Number Of Positions: 30
• Number Of Positions Loaded: All
• Pitch: 0.039" (1.00mm)
• Number Of Rows: 1
• Mounting Type: Surface Mount, Right Angle
• Termination: Solder
• Contact Finish: Gold
• Contact Finish Thickness: 12µin (0.30µm)
• Color: Beige
• Gender: Receptacle
• Pitch Spacing: 1mm
• No. Of Contacts: 30
• No. Of Rows: 1
• Contact Plating: Gold
• Contact Termination: Surface Mount Horizontal
• Contact Material: Copper Alloy
• Svhc: No SVHC
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Row Spacing: -
• Fastening Type: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 670-2205

MB-0170-1
Materials and Finishes
Board side connector: FI-XPB30S*L-HF**
Components
Materials/ Finishes
Copper alloy / Contact area: Au plating
Contact
Terminal area: Sn plating
Ground Plate
Copper alloy/ Sn plating
Insulator
Heat resistant plastic/ No
Shell
Stainless steel/ Sn plating
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JAE PMK Div. Proprietary. Copyright © 2007，Japan Aviation Electronics Industry, Ltd.