HPND-0002 Avago Technologies US Inc., HPND-0002 Datasheet - Page 2

• Manufacturer Part Number: HPND-0002
• Description: RF DIODE, PIN, 0.2PF, 100V, CHIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HPND-0002

• Capacitance Cd Max @ Vr F: 0.2pF
• Resistance @ If: 3.5ohm
• Forward Current If(av): 100mA
• Operating Temperature Range: -65°C To +150°C
• Series Resistance @ If: 305ohm
• Diode Type: RF Pin
• Function: Diode
• Configuration: Single
• Power Dissipation: 250mW
• Operating Temperature Classification: Military
• Reverse Voltage: 100V
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Breakdown Voltage: 100V
• Package / Case: Chip
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

For product information and a complete list of distributors, please go to our web site:
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5965-9143E
AV01-0640EN - November 28, 2006
Electrical Specifications at T
Assembly and Handling
Procedures for PIN Chips:
1. Storage
Devices should be stored in a dry nitrogen purged des-
sicator or equivalent.
2. Cleaning
If required, surface contamination may be removed
with electronic grade solvents. Typical solvents, such
as freon (T.F. or T.M.C.), acetone, deionized water, and
methanol, or their locally approved equivalents, can
be used singularly or in combinations. Typical cleaning
times per solvent are one to three minutes. DI water
and methanol should be used (in that order) in the final
cleans. Final drying can be accomplished by placing the
cleaned dice on clean filter paper and drying with an in-
frared lamp for 5-10 minutes. Acids such as hydrofluoric
(HF), nitric (HNO
used.
The effects of cleaning methods/ solutions should be
verified on small samples prior to submitting the en-
tire lot. Following cleaning, dice should be either used
in assembly (typically within a few hours) or stored in
clean containers in a reducing atmosphere or a vacuum
chamber.
Die Attach
Conditions
Epoxy or
Chip for
Eutectic
HPND-
0002
Test
Surface Mount
Equivalent
3
), and hydrochloric (HCl) should not be
Part No.
Nearest
HSMP-
3810
A
= 25°C
Equivalent
Axial Lead
Part No.
Nearest
5082-
3081
Breakdown
Minimum
I
R
Measure
Voltage
V
V
BR
R
≤ 10 µA
100
= V
(V)
BR
www.avagotech.com
Capacitance
f = 1.0 MHz
Maximum
3. Die Attach
a. Eutectic
Eutectic die attach can be accomplished by “scrub-
bing” the die with/without a preform on the header
to combine with the silicon in the die. Temperature is
approximately 400°C, with heating times of 5-10 sec-
onds. (Note–times and temperature utilized may vary
depending on the type, composition, and heat capacity
of the header or substrate used.) This method is recom-
mended for HPND-0002.
b. Epoxy
For epoxy die-attach, conductive silver-filled epoxies are
recommended. This method can be used for all Avago
Technologies’ PIN chips.
4. Wire Bonding
Either ultrasonic, thermosonic or thermocompression
bonding techniques can be employed. Suggested wire
is pure gold, 0.7 to 1.5 mil diameter.
V
C
R
j
0.20
= 50 V
(pF)
Resistance
I
f = 100MHz
F
R
= 100 mA
Series
S
3.5
( Ω)
Typical Parameters
I
I
R
Lifetime
F
Carrier
Typical
= 250 mA
τ (ns)
= 50 mA
1500
Typical Reverse
90% Recovery
I
Recovery
F
V
τ
R
= 20 mA
rr
Time
300
= 10 V
(ns)