TBU-LAB1 Bourns Inc., TBU-LAB1 Datasheet - Page 5

• Manufacturer Part Number: TBU-LAB1
• Description: SLIC PROTECTION KIT
• Manufacturer: Bourns Inc.
• Series: TBU™r

Specifications of TBU-LAB1

• Kit Type: SLIC Protection
• Kit Contents: (10) MOV-10D431K-ND - 10MM RADIAL DISC MOV(10) MOV-10D391K-ND - 10MM RADIAL DISC MOV(10) MOV-10D201K-ND - 10MM RADIAL DISC MOV(10) MOV-07D201K-ND - 7MM RADIAL DISC MOV(5) TBU-PL085-200-WHCT-ND - SURGE SUPP TBU DL 50OHM 850VIMP(5) TBU-PL085-100-WHCT-ND - SURGE SUPP TBU DL 50OHM 850VIMP(5) TBU-PL075-200-WHCT-ND - SURGE SUPP TBU DL 50OHM 750VIMP(5) TBU-PL075-100-WHCT-ND - SURGE SUPP TBU DL 50OHM 750VIMP(5) TBU-PL060-200-WHCT-ND - SURGE SUPP TBU DL 50OHM 600VIMP(5) TBU-PL060-100-WHCT-ND - SURGE SUPP TBU DL 50OHM 600VIMP(5) TBU-PL050-200-WHCT-ND - SURGE SUPP TBU DL 50OHM 500VIMP(5) TBU-PL050-100-WHCT-ND - SURGE SUPP TBU DL 50OHM 500VIMP(10) MOV-07D391K-ND - VARISTOR 390V 7MM RADIAL(5) TBU-PK085-100-WHCT-ND - SURGE SUPP TBU DL 100MA 850VIMP(5) TBU-PK060-100-WHCT-ND - SURGE SUPP TBU DL 100MA 600VIMP(5) TBU-PK050-100-WHCT-ND - SURGE SUPP TBU DL 100MA 500VIMP
• Lead Free Status / Rohs Status: Request inventory verification / RoHS Compliant

TBU
suggested layout should use Non-Solder Mask Defi ne (NSMD).
The recommended stencil thickness is 0.10-0.12 mm (.004-
.005 in.) with a stencil opening size 0.025 mm (.0010 in.) less
than the device pad size. As when heat sinking any power
device, it is recommended that wherever possible, extra PCB
copper area is allowed. For minimum parasitic capacitance, do
not allow any signal, ground or power signals beneath any of
the pads of the device.
Dark grey areas show added PCB copper area for better
thermal resistance.
Specifi cations are subject to change without notice.
Customers should verify actual device performance in their specifi c applications.
Product Dimensions
Recommended Pad Layout
®
TBU-PL Series - TBU
protectors have matte-tin termination fi nish. The
(.157)
4.00
(.033)
0.85
8
1
PIN 1 & BACKSIDE CHAMFER
(.256)
2
6.50
7
(.033)
0.85
3
6
®
(.035)
0.90
5
4
High Speed Protectors
(.000 - .002)
0.00 - 0.05
(.031 - .037)
0.80 - 0.95
(.033 ± .002)
0.85 ± 0.05
DIMENSIONS:
(.053)
1.335
(.053)
1.335
(.012)
0.30
(INCHES)
Thermal Resistance vs Additional PCB Cu Area
MM
(.045)
(.049)
1.15
1.25
120
100
(.030)
(.032)
0.75
80
60
40
20
0.825
0
(.029)
0.73
(.016)
0
0.40
(.028)
0.70
(.032)
0.825
(.053)
1.35
0.2
(.030)
(.028)
0.75
0.70
(.033)
(.016)
0.85
0.40
(.047)
1.20
0.4
(.047)
1.20
(.033)
0.85
Power in One Side of TBU
Total Power in Both Sides of TBU
0.6
Added Cu Area (Sq. In.)
(.053)
1.35
0.8
(.029)
(.033)
0.725
0.85
(.030)
0.75
1.0
(.050)
1.275
(.051)
1.30
(.012)
0.30
1.2
(.050)
(.050)
1.275
1.275
C
(.033)
(.010)
1.4
0.85
0.25
®
Device
PIN 1
1.6
®
Device
1.8
2.0