P-302-CCT-L Cinch Connectors, P-302-CCT-L Datasheet - Page 4

• Manufacturer Part Number: P-302-CCT-L
• Description: CONN PLUG 2POS W/LOCK JONES SLDR
• Manufacturer: Cinch Connectors
• Series: 300r

Specifications of P-302-CCT-L

• Connector Type: Plug, Jones
• Contact Type: Tab
• Number Of Positions: 2
• Pitch: 0.156" (3.96mm)
• Number Of Rows: 1
• Mounting Type: Free Hanging (In-Line)
• Fastening Type: Latch Lock
• Cable Termination: Solder Eyelet
• Wire Type: Discrete
• Features: Cable Clamp
• Contact Finish: Cadmium
• Color: Black
• Contact Material: Brass
• Contact Plating: Cadmium
• Housing Material: Thermoplastic
• Number Of Positions / Contacts: 2
• Voltage Rating: 250 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Contact Finish Thickness: -
• Row Spacing: -
• Lead Free Status / Rohs Status: No RoHS Version Available
• Other names: CJ202P; P-302-CCT-L-P; P302CCTL-P

The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
Call Toll Free: 1 [phone]