S-306-AB Cinch Connectors, S-306-AB Datasheet - Page 4

• Manufacturer Part Number: S-306-AB
• Description: CONN SOCKET 6POS W/BRKT PNL MNT
• Manufacturer: Cinch Connectors
• Series: 300r

Specifications of S-306-AB

• Connector Type: Receptacle, Jones
• Contact Type: Female Socket
• Number Of Positions: 6
• Pitch: 0.156" (3.96mm)
• Number Of Rows: 2
• Row Spacing: 0.156" (3.96mm)
• Mounting Type: Panel Mount
• Cable Termination: Solder Eyelet
• Wire Type: Discrete
• Contact Finish: Cadmium
• Color: Black
• Contact Termination: Solder
• No. Of Contacts: 6
• No. Of Rows: 2
• Connector Mounting: Panel
• Gender: Receptacle
• Contact Material: Phosphor Bronze
• Contact Plating: Cadmium
• Rohs Compliant: No
• Housing Material: Thermoplastic
• Number Of Positions / Contacts: 6
• Voltage Rating: 250 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Contact Finish Thickness: -
• Fastening Type: -
• Lead Free Status / Rohs Status: No RoHS Version Available
• Other names: CJ306S; S-306-AB-P; S306AB-P

The unique construction of the CIN::APSE contact
provides superior mechanical and electrical performance.
It is constructed of randomly wound molybdenum wire that
is formed into a cyclindrical shape. Standard CIN::APSE
contact diameters are 0.020" and 0.040".
Mechanical
• Small form factor (0.020" diameter by 0.32" min. high)
• Low compression force (approx. 2.5 oz. min. per contact)
• Multiple beam structures
• Several points of contact per button
• Extremely lightweight
• Natural wiping action
Electrical
• Short signal path
• Very low inductance and resistance
• Signal integrity tested in the GHz range
The basic button contact
configuration consists of a single
button installed in our patented
“hourglass” design.
The hourglass cavity retains the
CIN::APSE contact securely.
Typically 0.003" protrudes from the
top and the bottom of the insulator.
CIN::APSE
High-Speed Interconnect Technology
THE BUTTON CONTACT
CIN::APSE APPLIED
®
Step 1:
Using alignment features,
position the CIN::APSE
connector between a LGA chip
package and PCB or two PCBs
that have matching footprints.
1-2
Typical CIN::APSE Applications
• LGA package I/O to PC board (IC packages,
• PC board to PC board (parallel processors,
• Flex circuit to PC board (rigid flex, harnessing)
• Flex circuit to ceramic (chip to harness)
multi-chip modules)
enhancement/mezzanine cards)
Step 2:
Add Z-Axis compression
and secure.
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