SMDA15C-7.TBT Semtech, SMDA15C-7.TBT Datasheet - Page 5
![TVS DIODE ARRAY, 300W, 15V, SOIC](/photos/21/96/219631/4683385_sml.jpg)
SMDA15C-7.TBT
Manufacturer Part Number
SMDA15C-7.TBT
Description
TVS DIODE ARRAY, 300W, 15V, SOIC
Manufacturer
Semtech
Datasheet
1.SMDA05C-7.TBT.pdf
(7 pages)
Specifications of SMDA15C-7.TBT
Reverse Stand-off Voltage Vrwm
15V
Breakdown Voltage Range
16.7V
Clamping Voltage Vc Max
24V
Diode Configuration
Bidirectional
Peak Pulse Current Ippm
10A
Diode Case Style
SOIC
No. Of Pins
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SMDA15C-7.TBT
Manufacturer:
SEMTECH
Quantity:
6 765
Part Number:
SMDA15C-7.TBT
Manufacturer:
SEMTECH/美国升特
Quantity:
20 000
Device Connection for Protection of Seven Data Lines
The SMDAxxC-7 is designed to protect up to 7 data or
I/O lines. They are bidirectional devices and may be
used on lines where the signal polarities are above and
below ground.
The SMDAxxC-7 TVS arrays employ a monolithic struc-
ture. Therefore, the working voltage (V
down voltage (V
tial voltage between any two data line pins. For ex-
ample, the SMDA24C-7 is designed for a maximum
voltage excursion of ±12V between any two data lines.
The device is connected as follows:
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
PROTECTION PRODUCTS
PROTECTION PRODUCTS
Applications Information
2004 Semtech Corp.
Pins 1, 2, 3, 4, 5, 6 and 7 are connected to the
lines that are to be protected. Pin 8 is connected
to ground. The ground connections should be
made directly to the ground plane for best results.
The path length is kept as short as possible to
reduce the effects of parasitic inductance in the
board traces.
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
Minimize the path length between the TVS and the
protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
BR
) specifications apply to the differen-
RWM
) and break-
5
SMDA05C-7 THRU SMDA24C-7
DATA IN
DATA IN
Connection Diagram
Circuit Diagram
8
1
7
2
6
3
5
4
www.semtech.com
DATA OUT
DATA OUT