SMF05.TCT Semtech, SMF05.TCT Datasheet - Page 5

• Manufacturer Part Number: SMF05.TCT
• Description: TVS DIODE ARRAY, 200W, 5V, SC-70
• Manufacturer: Semtech

Specifications of SMF05.TCT

• Reverse Stand-off Voltage Vrwm: 5V
• Breakdown Voltage Range: 6V
• Clamping Voltage Vc Max: 12.5V
• Diode Configuration: Unidirectional
• Peak Pulse Current Ippm: 12A
• Diode Case Style: SC-70
• No. Of Pins: 5
• Number Of Elements: 4
• Polarity: Uni-Directional
• Operating Temperature Classification: Military
• Reverse Breakdown Voltage: 6V
• Clamping Voltage: 12.5V
• Reverse Stand-off Voltage: 5V
• Leakage Current (max): 10uA
• Peak Pulse Current: 12A
• Peak Pulse Power Dissipation: 200W
• Test Current (it): 1mA
• Operating Temp Range: -55C to 125C
• Mounting: Surface Mount
• Pin Count: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Device Connection for Protection of Four Data Lines
The SMFxx is designed to protect up to four unidirec-
tional data lines. The device is connected as follows:
1. Unidirectional protection of four I/O lines is
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
PROTECTION PRODUCTS
Applications Information
2008 Semtech Corp.
achieved by connecting pins 1, 3, 4, and 5 to the
data lines. Pin 2 is connected to ground. The
ground connection should be made directly to the
ground plane for best results. The path length is
kept as short as possible to reduce the effects of
parasitic inductance in the board traces.
Place the SMFxx near the input terminals or con-
nectors to restrict transient coupling.
Minimize the path length between the SMFxx and
the protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
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Protection of Four Unidirectional Lines
1
SMF Circuit Diagram
SMF05 and SMF12
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2
4
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