PAH200S48-12 TDK Corporation, PAH200S48-12 Datasheet - Page 52

• Manufacturer Part Number: PAH200S48-12
• Description: LAMBDA PART
• Manufacturer: TDK Corporation

Specifications of PAH200S48-12

• Rohs Compliant: YES

PAH
B-194
（2）Secondary (output side) control
“Thermal Design” .
PAH
 Parallel Operation
Parallel Operation can not be used.
 Series Operation
Series operation is possible for PAH300, 350S48 series.
Connections shown fig. 12-1 and fig. 12-2 are possible.
 Operating ambient temperature
There is no restriction on mounting direction but there
should be enough consideration for airflow so that heat
does not accumulate around the power module vicinity.
Determine external components configuration and mount-
ing direction on PCB such that air could flow through the
heatsink at forced cooling and conventional cooling.
By maintaining actual baseplate temperature below
100℃ , operation is possible.
For details on thermal design, refer to Application Notes
Note
Fig.13-1 Measurement Point of Baseplate Temperature
Fig.12-1 Series Operation due to High Output Voltage
: Maximum baseplate temperature is 100℃. For worst
case operating condition, verify baseplate temperature
at measurement point indicated in fig. 13-1.
Fig.12-2 Series Operation due to ±Output
300S48, 350S48
(output side)
Secondary
Input Side
Fig.10-2 CNT Connection (2)
TRM
TRM
TRM
TRM
+V
+S
+V
+S
+V
+S
+V
+S
CL
-S
-V
-S
-V
-S
-V
-S
-V
TRM
TRM
TRM
TRM
+V
+S
+V
+S
+V
+S
+V
+S
-S
-V
-S
-V
-S
-V
-S
-V
21mm
+
+
+
+
+
+
+
+
Output Side
Measurement Point
of Baseplate Temperature
POWER
MODULE
＋Vin
CNT
−Vin
＋
−
＋
−
＋
−
Load
Load
Load
＋
−
＋
−
＋
−
Load
Load
Load
“Thermal Design” .
 Operating Ambient Humidity
Take note that moisture could lead to power module ab-
normal operation or damage.
 Storage Ambient Temperature
Abrupt temperature change would cause moisture forma-
tion that leads to poor solderability of each terminal of the
power module.
 Storage Ambient Humidity
Take enough care when storing the power module be-
cause rust which causes poor solderability would form in
each terminal when stored in high temperature, high hu-
midity environment.
 Cooling Method
Operating temperature range is specified by the baseplate
temperature. Therefore, several methods of heat dissipa-
tion are possible.
For details on thermal design, refer to Application Notes
 Baseplate Temperature vs. Output Voltage Drift
Output voltage drift is defined as the rate of voltage
change when baseplate temperature only is changed dur-
ing operation.
 Withstand Voltage
This power module is designed to have a withstand volt-
age of 1.5kVDC between input and baseplate, 1.5kVDC
between input and output and 500VDC between output
and baseplate for 1 minute. When conducting withstand
voltage test during incoming inspection, be sure to apply
DC voltage. Also, set the current limit value of the with-
stand voltage testing equipment to 10mA.
Be sure to avoid conducting test with AC voltage because
this would cause power module damage.
Furthermore, avoid throw in or shut off of the testing equip-
ment when applying or when shutting down the test volt-
age. Instead, gradually increase or decrease the applied
voltage. Take note especially not to use the timer of the
test equipment because when the timer switches the ap-
plied voltage off, impulse voltage which has several times
the magnitude of the applied voltage is generated causing
damage to the power module.
Connect the terminals as shown in the diagram below.
For better improvement of power module reliability, de-
rating of baseplate temperature when using is recom-
mended.
・All specifications are subject to change without notice.