LX40-12P Hirose Electric Co Ltd, LX40-12P Datasheet - Page 6

CONN PLUG 12POS .5MM SOLDER

LX40-12P

Manufacturer Part Number
LX40-12P
Description
CONN PLUG 12POS .5MM SOLDER
Manufacturer
Hirose Electric Co Ltd
Series
LXr
Datasheet

Specifications of LX40-12P

Pitch
0.020" (0.50mm)
Connector Type
Plug
Contact Type
Male Pin
Number Of Positions
12
Number Of Rows
1
Mounting Type
Free Hanging (In-Line)
Cable Termination
Solder
Wire Type
Discrete
Contact Finish
Gold
Color
Black
Number Of Positions / Contacts
12
Contact Plating
Gold
Contact Material
Copper Alloy
Gender
Male
Current Rating
0.5 A
Mounting Style
Cable
Termination Style
Solder
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Contact Finish Thickness
-
Row Spacing
-
Fastening Type
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
*LX40-12P
H11399
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
6
LX Series●Ultra Low-profile Interface Connectors with 2.0 mm Mounting Height
■Receptacles Recommended Temperature Profile
B
B
250
200
150
100
(ç)
Applicable Plug Cable
Mated Condition Dimensions
50
Note 1: Applicable cable sizes are guidelines. (There may be slight differences depending on the cable outer insulation)
Note 2: Cables must be attached using single piece overmolded bushings on the cable.
Note 3: Please refer to applicable Cable Termination Procedures Manual for correct plug assembly and cable termination.
Note 4: Contact HRS for cable assemblies.
Plug
Part number
LX40-12P
LX40-16P
LX40-20P
180ç
150ç
90±30s
Receptacle
Cable diameter
PEAK:250
Ø4 max.
Ø4.5 max.
Ø5 max.
230ç min.
+5
0
ç
1.4
2
90±10s
Ø0.6 mm max. (AWG 30 to 32 or equivalent)
(mm)
Wire size
HRS test conditions
Solder composition
Test board
The temperature profiles are based on the above
conditions. In individual applications the actual
temperature may vary, depending on solder
paste type, volume/thickness and board
size/thickness. Contact your solder paste and
equipment manufacture for specific
recommendations.
(mm)
Paste, 96.5%Sn/3.0%Ag/0.5%Cu
Glass epoxy 35mm x 35mm x 0.8mm thick

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