44828-1162 Molex Inc, 44828-1162 Datasheet - Page 15

• Manufacturer Part Number: 44828-1162
• Description: CONN RCPT 16POS .8MM RT/ANG SMD
• Manufacturer: Molex Inc
• Series: HandyLink™ 44828r

Specifications of 44828-1162

• Connector Style: Receptacle
• Connector Type: Handylink
• Number Of Positions: 16
• Mounting Type: Surface Mount, Right Angle
• Termination: Solder
• Contact Finish: Gold
• Color: Black
• Housing Material: Thermoplastic, High Temperature
• Insulation Resistance: 1000 M Ohms
• Mounting Angle: Right
• Operating Temperature Range: - 40 C to + 85 C
• Number Of Positions / Contacts: 16
• Pitch: 0.8 mm
• Contact Plating: Gold
• Contact Material: High Performance Alloy (HPA)
• Gender: Female
• Current Rating: 1.5 A
• Mounting Style: SMD/SMT
• Termination Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Contact Finish Thickness: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 044828-1162; 044828-1162-C; 0448281162; 0448281162-C; 44828-1162-C; 448281162; 448281162-C; WM17127TR

DOCUMENT NUMBER:
REVISION:
B
6.3.2
NOTE: The sealant or cover should enclose the cavities under the latches, whether or not wires are soldered to the latches. Omission
The next step after soldering is to pre-seal or encapsulate the back end of the connector and hold the wires in place using a silicone
sealant or a low-pressure Macro-melt polyamide adhesive molding. The sealant will prevent accidental shorting between adjacent
terminals and discourage intrusion of over-mold resin into the terminal and latch cavities. An illustration of the pre-seal coverage is
shown below. Care must be taken to ensure that no encapsulant enters the terminal or latch cavities.
An alternate method is to combine one or more molded ‘covers’ to block entire sections where void circuits are present, then use a
pre-seal or encapsulant to hold the wires separate. This is illustrated below.
of this step would allow the final over-mold resin to extrude into cavities in the housing that could disable latch and terminal function.
Encapsulation
SD-44828-001
EC No:
DATE:
ECR/ECN INFORMATION:
UCP2008-0962
2007/10/30
TITLE:
APPLICATION SPECIFICATION
CREATED / REVISED BY:
M. Simmel / D. Morgan
Figure 7.
Encapsulated plug connector
Figure 8.
Covered and encapsulated plug connector
HANDYLINK™
HANDYLINK™I/O CONNECTOR SYSTEM
APPLICATION SPECIFICATION
CHECKED BY:
B. Barker
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
APPROVED BY:
S. Miller
SHEET No.
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