812002 MULTICOMP, 812002 Datasheet - Page 2
![SOLDER WIRE, , 1MM, 250G](/photos/20/82/208287/42268604_sml.jpg)
812002
Manufacturer Part Number
812002
Description
SOLDER WIRE, , 1MM, 250G
Manufacturer
MULTICOMP
Datasheet
1.812000.pdf
(5 pages)
Specifications of 812002
External Diameter
1mm
Material Composition
Sn97.1Ag2.6Cu0.3
Melting Temperature
217°C
Weight
250g
Svhc
No SVHC (18-Jun-2010)
Bit Temperature
350°C
Flux Type
400, Rosin Based, Halide Free
Standard
DIN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Cleaning: In most industrial and consumer electronics applications cleaning will not be required and the product may therefore be
used to complement a no clean wave soldering or reflow process or to allow repairs to cleaned boards without the need for a second
cleaning process.
Should cleaning be required, this is best achieved using a special solvent cleaner. Cleaning through saponification is not
recommended.
Technical Specification:
Alloys:
The alloys used for Multicomp Typ 400, 505 and 511 cored solder wires conform to the purity requirements of the common national
and international standards. A wide range of wire diameters is available manufactured to close dimensional tolerances.
Flux:
The solid fluxes are based on modified rosins and carefully selected activators. In use they exhibit a mild rosin odour and leave a
small quantity of clear residue.
Test
Acid value mg/KOH/g
Halide content %
J-STD-004
-solder spread mm
-corrosion test
SIR test (without cleaning)
-IPC-SF-818 Class3
-Bellcore TR-NWT-000078
Electromigration-test SIR test
(without cleaning) Bellcore
TR-NWT-000078
Classification
-EN 29454-1
-J-STD-004
-IPC-SF-818
No-Clean Flux
Lead Free Tin/Silver/Copper Alloy
2
Kristall Flux Properties
LR3CN
RO L0
Pass
Pass
Pass
Pass
1.2.3
400
215
210
0
Page 2
MR3CN
RO M1
Pass
Pass
Pass
Pass
1.2.2
505
170
315
0.5
MR3CN
RO M1
Pass
Pass
Pass
Pass
1.2.2
511
170
340
1.1
25/05/06 V1.0