509-0519 MULTICOMP, 509-0519 Datasheet

SOLDER WIRE, 60/40, 0.5MM, 250G

509-0519

Manufacturer Part Number
509-0519
Description
SOLDER WIRE, 60/40, 0.5MM, 250G
Manufacturer
MULTICOMP
Datasheet
1.3096525-M.pdf (2 pages)

Specifications of 509-0519

External Diameter
0.5mm
Material Composition
60/40 (60% Tin, 40% Lead)
Melting Temperature
180°C
Weight
0.25kg
Bit Temperature
308°C
Flux Type
309, Rosin Based
Wire Diameter
0.5mm
Outer Diameter
0.5mm
Solder Alloy
60/40 Sn/Pb
Rohs Compliant
No
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
ROSIN BASED CORED SOLDER WIRE FLUX
Properties of Multicore 309 solid flux for cored wires:
PRODUCT RANGE
Multicore 309 cored wires are manufactured with a range of
flux contents. Although users will normally be using
products with a nominal flux content of 3%.
Multicore 309 cored wires are available in a variety of alloys
conforming to J-STD-006 and EN 29453 or alloys
conforming to similar national or international standards. For
details refer to document “Properties of Alloys used in Cored
Solder Wires ”. A wide range of wire diameters is available.
Alternative flux contents and alloys may be manufactured to
special order.
TECHNICAL SPECIFICATION
A full description of test methods and detailed test results are
available on request.
Alloys: The alloys used for Multicore flux cored solder wires
conform to the purity requirements of the common national
and international standards. A wide range of wire diameters
is available manufactured to close dimensional tolerances.
For details refer to document “Properties of Alloys used in
Cored Solder Wires ”.
Flux: Multicore 309 solid flux is based on a blend of novel
activators and resins. It has a mild characteristic odour and
leaves a clear pale residue.
Test
Acid value
Halide content
EN 29451-1
Classification
JSTD Classification
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
Rosin based
Fast soldering
Pale residues
Solders difficult surfaces
Good spread on nickel, stainless steel, chromel,monel,
constantin, etc.
Heat stable – low fuming
Mild odour
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
TYPICAL FLUX PROPERTIES
309
200mg KOH/g
<1.0%
1.1.2
ROM1
NOT
FOR PRODUCT SPECIFICATIONS
PRODUCT.
SPECIAL PROPERTIES
Surface Insulation Resistance: Multicore 309 flux passes
the J-STD-004 SIR test and other elements of J-STD-004 test
protocols associated with the flux classification ROM1.
Electromigration Test: Multicore 309 passes the Bellcore
GR-78-CORE Electromigration test.
RECOMMENDED OPERATING CONDITIONS
Soldering iron: Good results should be obtained using a
range of tip temperatures. However, the optimum tip
temperature and heat capacity required for a hand soldering
process is a function of both soldering iron design and the
nature of the task and care should be exercised to avoid
unnecessarily high tip temperatures for excessive times. A
high tip temperature will increase any tendency to flux
spitting and it may produce some residue darkening.
The soldering iron tip should be properly tinned and this may
be achieved using Multicore cored wire. Severely
contaminated soldering iron tips should first be cleaned and
pre-tinned using Multicore Tip Tinner/Cleaner, then wiped
on a clean, damp sponge before re-tinning with Multicore
cored wire.
Soldering process: Multicore cored wires contain a careful
balance of resins and activators to provide clear residues,
maximum activity and high residue reliability, without
cleaning in most situations. To achieve the best results from
Multicore solder wires, recommended working practices for
hand soldering should be observed as follows:
Apply the soldering iron tip to the work surface,
ensuring that it simultaneously contacts the base material
and the component termination to heat both surfaces
adequately. This process should only take a fraction of a
second.
Apply Multicore flux cored solder wire to a part of the
joint surface away from the soldering iron and allow to
flow sufficiently to form a sound joint fillet – this should
be virtually instantaneous. Do not apply excessive
solder or heat to the joint as this may result in dull, gritty
fillets and excessive or darkened flux residues.
Remove solder wire from the work piece and then
remove the iron tip. The total process will be very rapid,
depending upon thermal mass, tip temperature and
configuration and the solderability of the surfaces to be
joined.
Multicore 309
Technical Data Sheet
May 2007

509-0519 Summary of contents

Page 1

... Do not apply excessive solder or heat to the joint as this may result in dull, gritty fillets and excessive or darkened flux residues. Remove solder wire from the work piece and then remove the iron tip ...

Page 2

... Multicore flux cored solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability of Multicore fluxes means they are also well suited to soldering applications requiring high melting temperature alloys ...