XF2M-1015-1A Omron, XF2M-1015-1A Datasheet - Page 15
![CONN FPC 10POS 0.5MM PITCH SMD](/photos/2/87/28713/xf2m-1015-1a_sml.jpg)
XF2M-1015-1A
Manufacturer Part Number
XF2M-1015-1A
Description
CONN FPC 10POS 0.5MM PITCH SMD
Manufacturer
Omron
Series
XF2Mr
Specifications of XF2M-1015-1A
Connector Type
Top and Bottom Contacts
Number Of Positions
10
Pitch
0.020" (0.50mm)
Ffc, Fcb Thickness
0.30mm
Height Above Board
0.083" (2.10mm)
Mounting Type
Surface Mount, Right Angle
Cable End Type
Straight
Termination
Solder
Locking Feature
Rotary Lock, Backlock
Contact Finish
Gold
Contact Finish Thickness
5.9µin (0.15µm)
Operating Temperature
-30°C ~ 85°C
Current Rating
0.500A
Voltage Rating
50V
Housing Material
Liquid Crystal Polymer (LCP)
Gender
Receptacle
Pitch Spacing
0.5mm
No. Of Contacts
10
No. Of Rows
1
Contact Plating
Gold
Ffc/fpc Thickness
0.3mm
Contact Termination
Surface Mount Vertical
Product Type
PCB
Number Of Positions / Contacts
10
Mounting Angle
Straight
Mounting Style
Through Hole
Contact Material
Spring Copper Alloy / Nickel Substrate
Termination Style
Solder Pin
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
OR717TR
XF2M10151A
XF2M10151A
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XF2M-1015-1A
Manufacturer:
OMRON
Quantity:
30 000
Rotary Lock Achieves High Reliability and Superior
Work Efficiency.
• Double-sided contact reduces the number of parts.
• Applicable FPC thickness of 0.3 mm.
■ Ratings and Specifications
XF2M-@@15-1A/1AH
■ Dimensions
XF2M-@@15-1@
XF2M-@@15-1@H
Table of Dimensions
Note: Dotted lines refer to the shape and dimensions of models XF2M-5515-1 H
and 6015-1 H.
Note: “H” refers to the shape and dimensions for model series XF2M-5515 and
6015. Please refer to the drawings for more information.
Rated current
Rated voltage
Contact resistance
Insulation resistance 100 M Ω min. (at 250 V DC)
Withstand voltage
Insertion tolerance
Ambient operating
temperature
Pins
(See
note
Rotary Backlock Connector
(0.5-mm Pitch, Double-sided Contact)
(55) XF2M-5515-1@H 27.0 28.1 31.0 31.6 29.6 28.6 32.0
(60) XF2M-6015-1@H 29.5 30.6 33.5 34.1 32.1 31.1 34.5
RoHS Compliant
2.)
10
12
14
18
20
22
24
26
30
32
33
34
35
36
38
40
42
45
50
55
60
XF2M-1015-1@
XF2M-1215-1@
XF2M-1415-1@
XF2M-1815-1@
XF2M-2015-1@
XF2M-2215-1@ 10.5 11.6 14.5 15.1 13.1 12.1 15.5
XF2M-2415-1@ 11.5 12.6 15.5 16.1 14.1 13.1 16.5
XF2M-2615-1@ 12.5 13.6 16.5 17.1 15.1 14.1 17.5
XF2M-3015-1@ 14.5 15.6 18.5 19.1 17.1 16.1 19.5
XF2M-3215-1@ 15.5 16.6 19.5 20.1 18.1 17.1 20.5
XF2M-3315-1@ 16.0 17.1 20.0 20.6 18.6 17.6 21.0
XF2M-3415-1@ 16.5 17.6 20.5 21.1 19.1 18.1 21.5
XF2M-3515-1@ 17.0 18.1 21.0 21.6 19.6 18.6 22.0
XF2M-3615-1@ 17.5 18.6 21.5 22.1 20.1 19.1 22.5
XF2M-3815-1@ 18.5 19.6 22.5 23.1 21.1 20.1 23.5
XF2M-4015-1@ 19.5 20.6 23.5 24.1 22.1 21.1 24.5
XF2M-4215-1@ 20.5 21.6 24.5 25.1 23.1 22.1 25.5
XF2M-4515-1@ 22.0 23.1 26.0 26.6 24.6 23.6 27.0
XF2M-5015-1@ 24.5 25.6 28.5 29.1 27.1 26.1 29.5
(See note 1.)
Model
0.5 A AC/DC
50 V AC/DC
50 m Ω max. (at 20 mV max., 100 mA max.)
250 V AC for 1 min.
20 times
− 30 to 85 ° C
(with no icing or condensation)
(leakage current: 1 mA max.)
A
4.5
5.5
6.5
8.5
9.5 10.6 13.5 14.1 12.1 11.1 14.5
B
5.6
6.6
7.6 10.5 11.1
9.6 12.5 13.1 11.1 10.1 13.5
8.5
9.5 10.1
C
9.1
D
7.1
8.1
9.1
E
6.1
7.1 10.5
8.1 11.5
F
G
9.5
Reference pin mark
0.5
PCB Mating Dimensions (Top View)
±0.05
■ Materials and Finish
XF2M-@@15-1A/1AH
Housing
Slider
Contacts
Hold-down Spring copper alloy/fused-tin plating (1.5 μ m)
0.5
A
F
G
±0.05
E
±0.1
A
B
C
D
±0.1
(See note.)
LCP resin (UL94V-0)/natural
LCP resin (UL94V-0)/black
Spring copper alloy/nickel substrate (2 μ m),
gold-plated contacts (0.15 μ m)
0.25
0.15
(See note.)
±0.05
2.6
1.5
±0.1
±0.1
3.4
1.1
2
(Reinforcement
4.9
board)
4.5
Note: Dotted lines indicate the shape
0.35
0.5
0.5
2.5 min.
Applicable FPC Dimensions
4.88 (See note.)
±0.1
±0.05
±0.03
and dimensions of 55-pin or
60-pin connectors.
6.2 (See note.)
4.62
5.2
XF2M
5.9
(B−0.1)
0.92
(See note.)
±0.05
0.6
2.1
(See
note.)
3.1
T=0.3
(Conductive
plating)
3.2
(See
note.)
1.35
(Effective
interface
length)
±0.05
15