DB-60-20 Cinch Connectors, DB-60-20 Datasheet - Page 3

• Manufacturer Part Number: DB-60-20
• Description: CONN DSUB15 PLUG DUST CAP
• Manufacturer: Cinch Connectors
• Type: Plugr

Specifications of DB-60-20

• Accessory Type: Cap (Cover), Dust
• Number Of Positions: 15
• Product: Tools & Accessories
• Number Of Positions / Contacts: 25
• Shell Size: B
• Gender: Male
• Housing Material: Polyethylene
• Color: Black
• Height, External: 0.430 in.
• Height, Internal: 0.363 in.
• Length, Inner: 1.568 in.
• Length, Outer: 1.635 in.
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: D-Sub Connectors, Male
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With: All Cinch D-subminiature connectors
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 4741192302

CIN::APSE
High-Speed Interconnect Technology
Contact Material: Molybdenum
CIN::APSE Contact Plating: Gold
Plunger Material: Copper alloy
Plunger Plating: Gold
Insulator Material: Liquid crystal polymer
Packaging Tray Material: Anti-static ABS
Button-Only Configuration with 0.020" (0.5 mm) Diameter
Temperature Life Testing: 1000 Hours @ 200°C
Thermal Shock: 2,000 Cycles @ 20°C to 110°C
Humidity: 5,000 Hours @ 30°C to 80°C, 80% RH
Salt Spray: 96 Hours
Low Temperature: Operates in liquid nitrogen (77°K)
Bellcore TR-NWT-001217: Passed with plungers
Button-Only Configuration with 0.020" (0.5 mm) Diameter
Button-Only Configuration with 0.020" (0.5 mm) diameter
Durability: 25,000 Z-axis actuations (CIN::APSE contact only)
Shock: 100 Gs; 6 milliseconds, no discontinuity
Vibration: 20 Gs; 10-20,000 Hz; no discontinuity
Call Toll Free: 1 [phone]
Dielectric Withstanding Voltage:
High signal speed capability enabling frequencies greater than 20 GHz.
Z-Axis, solderless, compression mount interconnect system.
Applications include production Land Grid Array (LGA) integrated circuit sockets, flex circuit to
PCB, and parallel PCB to PCB interconnections.
Provides solutions to many of the problems associated with through hole and surface mount
soldered technology.
Enables upgrade and system maintenance strategies.
Available in custom I/O configurations and I/O counts from 1 to over 5,000.
Offers low profile capabilities with compressed signal path length as short as 0.8 mm.
Contact centerline spacing of 1mm or greater.
Excellent reliability in commercial, military, and aerospace applications.
Application can result in lower installed and system maintenance costs.
Current-Carrying Capability:
greater than 2 nanoseconds
greater than 2 nanoseconds
Insulation Resistance:
®
DC Resistance:
Inductance:
15mΩ average
Less than 1 nH
Up to 3 Amps.
25,000 MegΩ @ 500 VDC
900 VAC at sea level
1-1
IC Component to Board Socket (LGA)
Flex Circuit to PCB