NB20R00105KBA AVX Corporation, NB20R00105KBA Datasheet - Page 5

• Manufacturer Part Number: NB20R00105KBA
• Description: THERMISTOR, NTC, 1000K, 1206
• Manufacturer: AVX Corporation

Specifications of NB20R00105KBA

• Thermistor Type: NTC
• Resistance: 1000kohm
• Beta Value (k): 4400
• Svhc: No SVHC (15-Dec-2010)
• External Length / Height: 4400mm
• Operating Temperature Max: +150°C
• Package / Case: 1206
• Resistance Tolerance: ±
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Surface Mounting Guide
Chip Thermistor – Application Notes
18
STORAGE
Good solderability is maintained for at least twelve months,
provided the components are stored in their “as received”
packaging at less than 40°C and 70% RH.
SOLDERABILITY / LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
NB products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes
Recommended profiles for reflow and wave soldering are
shown below for reference.
NC products are recommended for lead soldering application
or gluing techniques.
P/N
NC
NB
300
250
200
150
100
50
0
0
• Pre-heating: 150°C ±15°C / 60-90s
• Max. Peak Gradient: 2.5°C/s
• Peak Temperature: 245°C ±5°C
• Time at >230°C: 40s Max.
Nickel Barrier
Termination
AgPdPt
Reflow
Type
with
300
250
200
150
100
50
50
0
(Minimize soldering time)
1min
peak
Preheat
100
Tin/Lead
Solder
60/40
60/40
temperatures
1min
150
10 sec. max
Temp ºC
260 ± 5
260 ± 5
Solder
220ºC
250ºC
to
200
Natural
Cooling
up
Time (s)
Time Seconds
Immersion
250
to
15 max
30 ± 1
270ºC.
300
a) The visual standards used for evaluation of solder joints
b) Resin color may darken slightly due to the increase in
c) Lead-free solder pastes do not allow the same self align-
REFLOW SOLDERING
WAVE SOLDERING
Case
Case
0402
0603
0805
1206
0603
0805
1206
Size
Size
will need to be modified as lead free joints are not as bright
as with tin-lead pastes and the fillet may not be as large.
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to be
modified.
temperature required for the new pastes.
RECOMMENDED
SOLDERING PAD
LAYOUT
Dimensions in
mm (inches)
NB23
NB21
NB12
NB20
NB21
NB12
NB20
P/N
P/N
Wave
300
250
200
150
100
50
0
(Preheat chips before soldering)
T/maximum 150°C
(.067)
(.091)
(.118)
(.157)
(.122)
(.157)
(.197)
1.70
2.30
3.00
4.00
3.10
4.00
5.00
D1
D1
1 to 2 min
Preheat
T
(.024)
(.031)
(.039)
(.039)
(.047)
(.059)
(.059)
0.60
0.80
1.00
1.00
1.20
1.50
1.50
D2
D2
3 sec. max
D1
230ºC
250ºC
(.020)
(.028)
(.039)
(.079)
(.028)
(.039)
(.079)
0.50
0.70
1.00
2.00
0.70
1.00
2.00
to
D3
D3
D2
D3
D4
Natural
Cooling
D5
(.024)
(0.31)
(.039)
(.039)
(.047)
(.059)
(.059)
0.60
0.80
1.00
1.00
1.20
1.50
1.50
D4
D4
(.020)
(.030)
(.049)
(.098)
(.030)
(.049)
(.063)
0.50
0.75
1.25
2.50
0.75
1.25
1.60
D5
D5