B57421V2681J62 EPCOS Inc, B57421V2681J62 Datasheet - Page 10
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B57421V2681J62
Manufacturer Part Number
B57421V2681J62
Description
THERMISTOR NTC 680 OHM 5% 0805
Manufacturer
EPCOS Inc
Series
B574**V2r
Type
NTCr
Specifications of B57421V2681J62
Package / Case
0805 (2012 Metric)
Resistance In Ohms @ 25°c
680
Resistance Tolerance
±5%
B Value Tolerance
±3%
B25/50
3940K
B25/85
3980K
B25/100
4000K
Operating Temperature
-55°C ~ 125°C
Power - Max
210mW
Mounting Type
Surface Mount
Description Of Terminals
Leadless
Mounting Style
Surface Mount
Pin Count
2
Resistance @ 25c
680Ohm
Thermal Time Constant
10s
Percentage Of Resistance Tolerance @ 25c
±5
Product Length (mm)
2mm
Product Depth (mm)
1.25mm
Resistance
680 Ohms
Tolerance
5 %
Termination Style
SMD/SMT
Operating Temperature Range
- 55 C to + 125 C
Power Rating
210 MW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/75
-
Lead Length
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
B57421V2681J 62
B57421V2681J062
B57421V2681J062
Mounting instructions
1
1.1
SMD NTC thermistors can be provided with a nickel barrier termination or on special request with
silver-palladium termination. The usage of mild, non-activated fluxes for soldering is recommend-
ed as well as a proper cleaning of the PCB.
The nickel barrier layer of the silver/nickel/tin termination (see figure 1) prevents leaching of the
silver base metalization layer. This allows great flexibility in the selection of soldering parameters.
The tin prevents the nickel layer from oxidizing and thus ensures better wetting by the solder. The
nickel barrier termination is suitable for all commonly-used soldering methods.
Figure 1
SMD NTC thermistors, structure of nickel barrier termination
1.1.1
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Wetting of soldering areas 95%.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
1.1.2
Preconditioning: Immersion into flux F-SW 32.
Evaluation criterion: Leaching of side edges 1/3.
Solder
SnPb 60/40
SnAg (3.0 ... 4.0), Cu (0.5 ... 0.9)
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
Nickel barrier termination
Soldering
SMD NTC thermistors
Solderability (test to IEC 60068-2-58)
Resistance to soldering heat (test to IEC 60068-2-58)
Page 10 of 20
Bath temperature ( C)
215 3
245 3
Bath temperature ( C)
260
260
5
5
Dwell time (s)
3
3
Dwell time (s)
10
10
B574**V2