B57421V2102J62 EPCOS Inc, B57421V2102J62 Datasheet - Page 15

• Manufacturer Part Number: B57421V2102J62
• Description: THERMISTOR NTC 1.0K OHM 5% 0805
• Manufacturer: EPCOS Inc
• Series: B574**V2r
• Type: NTCr

Specifications of B57421V2102J62

• Resistance In Ohms @ 25°c: 1K
• Resistance Tolerance: ±5%
• B Value Tolerance: ±3%
• B25/50: 3940K
• B25/85: 3980K
• B25/100: 4000K
• Operating Temperature: -55°C ~ 125°C
• Power - Max: 210mW
• Mounting Type: Surface Mount
• Package / Case: 0805 (2012 Metric)
• Thermistor Type: NTC
• Resistance: 1kohm
• Beta Value (k): 4000
• Svhc: No SVHC (18-Jun-2010)
• Beta Value Lower Limit Temperature: 25°C
• Operating Temperature Max: +125°C
• Operating Temperature Min: -55°C
• Tolerance: 5 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 55 C to + 125 C
• Power Rating: 210 MW
• Description Of Terminals: Leadless
• Mounting Style: Surface Mount
• Pin Count: 2
• Resistance @ 25c: 1kohm
• Thermal Time Constant: 10s
• Percentage Of Resistance Tolerance @ 25c: ±5
• Product Length (mm): 2mm
• Product Depth (mm): 1.25mm
• Thermistor Tolerance: ± 5%
• Thermistor Case Style: 0805
• No. Of Pins: 2
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/75: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 495-2115-2; B57421V2102J 62; B57421V2102J062

6
a) Component placement
b) Cracks
c) Component orientation
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement and compensation
SMD NTC thermistors, case size 0805 (2012)
Placement and orientation of SMD NTC thermistors on PCB
Page 15 of 20
It is recommended that the PC board
should be held by means of some
adequate supporting pins such as
shown left to prevent the SMDs from
being damaged or cracked.
When placing a component near an
area which is apt to bend or a grid
groove on the PC board, it is advisable
to have both electrodes subjected to
uniform stress, or to position the
component's electrodes at right angles
to the grid groove or bending line (see
c) Component orientation).
Choose a mounting position that
minimizes the stress imposed on the
chip during flexing or bending of the
board.
B574**V2