NTCS0402E3472JMT Vishay, NTCS0402E3472JMT Datasheet - Page 5
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NTCS0402E3472JMT
Manufacturer Part Number
NTCS0402E3472JMT
Description
THERMISTOR NTC 4.7K OHM SMT 0402
Manufacturer
Vishay
Series
2381r
Type
NTCr
Specifications of NTCS0402E3472JMT
Resistance In Ohms @ 25°c
4.7K
Resistance Tolerance
±5%
B Value Tolerance
±3%
B25/85
3595K
Operating Temperature
-40°C ~ 150°C
Power - Max
70mW
Mounting Type
Surface Mount
Package / Case
0402 (1005 Metric)
Description Of Terminals
Leadless
Mounting Style
Surface Mount
Pin Count
2
Screening Level
Automotive
Resistance @ 25c
4.7kohm
Thermal Time Constant
5s
Percentage Of Resistance Tolerance @ 25c
±5
Accuracy
±3
Operating Temperature Min Deg. C
-40C
Operating Temperature Max Deg. C
150C
Product Length (mm)
1mm
Product Height (mm)
0.5mm
Product Depth (mm)
0.5mm
Lead Free Status / RoHS Status
Lead free by exemption / RoHS Compliant
B0/50
-
B25/50
-
B25/75
-
B25/100
-
Lead Length
-
Lead Free Status / RoHS Status
Lead free by exemption / RoHS Compliant, Supplier Unconfirmed
Other names
2381 615 43472
BC2327TR
BC2327TR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTCS0402E3472JMT
Manufacturer:
VISHAY/威世
Quantity:
20 000
SOLDERING CONDITIONS
This SMD thermistor is suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum temperature
of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with “IEC 60286-3”. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
Document Number: 29003
Revision: 25-May-10
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D 0
0
≈ 245 °C
A 0
260 °C
215 °C
180 °C
130 °C
B 0
P 1
50
P 2
Reflow Soldering
TEST METHOD
2 K/s
P 0
100
T
C
Time (s)
150
0.5
For technical questions, contact:
10 s
10 s
E 1
F
JWB288
40 s
Resistance to soldering heat
W
SMD 0402, Glass Protected
200
0.5
Dimensions of the solder lands
Solderability
NTC Thermistors
TEST
T 1
T
250
1.5
Notes
(1)
(2)
NTCS0402E3.....T/2381 615 4....
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
Measured 0.3 mm above base pocket
P
1
0
0
1
0
1
2
0
0
nlr@vishay.com
(1)
(1)
(2)
cover tape
pitch cumulative error over any 10 pitches ± 0.2 mm
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
Vishay BCcomponents
≈ 120 °C
DIMENSION
150
Time (s)
< 0.1
0.65
1.15
1.75
1.55
8.0
3.5
4.0
4.0
2.0
0.8
Min. 95 % of surface wetted
200
REQUIREMENTS
ΔR/R < 5 %
250
20 s min.
40 s max.
≈ 60 s
TOLERANCE
www.vishay.com
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.1
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
max.
-
350
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