B57321V2681J60 EPCOS Inc, B57321V2681J60 Datasheet - Page 43

• Manufacturer Part Number: B57321V2681J60
• Description: THERMISTOR NTC 680 OHM 5% 0603
• Manufacturer: EPCOS Inc
• Series: B573**V2r
• Type: NTCr

Specifications of B57321V2681J60

• Resistance In Ohms @ 25°c: 680
• Resistance Tolerance: ±5%
• B Value Tolerance: ±3%
• B25/50: 3940K
• B25/85: 3980K
• B25/100: 4000K
• Operating Temperature: -55°C ~ 125°C
• Power - Max: 180mW
• Mounting Type: Surface Mount
• Package / Case: 0603 (1608 Metric)
• Resistance: 680 Ohms
• Tolerance: 5 %
• Termination Style: SMD/SMT
• Operating Temperature Range: - 55 C to + 125 C
• Power Rating: 180 mW
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/75: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: B57321V2681J 60; B57321V2681J060

Cautions and warnings
General
See "Important notes" at the end of this document.
Storage
Handling
Soldering
Mounting
Please read Cautions and warnings and
Important notes at the end of this document.
Temperature measurement
SMDs with nickel barrier termination, case size 0603
Store thermistors only in original packaging. Do not open the package before storage.
Storage conditions in original packaging: storage temperature
humidity 75% annual mean, maximum 95%, dew precipitation is inadmissible.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing
material may be deformed or SMDs may stick together, causing problems during mounting.
Avoid contamination of thermistors surface during storage, handling and processing.
Avoid storage of thermistor in harmful environments like corrosive gases (SOx, Cl etc).
After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as
possible.
Solder thermistors after shipment from EPCOS within the time specified:
NTC thermistors must not be dropped. Chip-offs must not be caused during handling of NTCs.
Components must not be touched with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
When NTC thermistors are encapsulated with sealing material or overmolded with plastic
material, the precautions given in chapter “Mounting instructions”, “Sealing, potting and
overmolding” must be observed.
Electrode must not be scratched before/during/after the mounting process.
Contacts and housings used for assembly with thermistor have to be clean before mounting.
During operation, the thermistor’s surface temperature can be very high (ICL). Ensure that
adjacent components are placed at a sufficient distance from the thermistor to allow for proper
cooling ot the thermistors.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can
withstand this temperature.
Make sure that thermistors (ICLs) are adequately ventilated to avoid overheating.
Avoid contamination of thermistor surface during processing.
SMDs: 12 months
Leaded components: 24 months
Page 43 of 45
25 C ... +45 C, relative
B573**V2