NTCS0805E3104GXT Vishay, NTCS0805E3104GXT Datasheet - Page 7

• Manufacturer Part Number: NTCS0805E3104GXT
• Description: THERMISTOR NTC 100K OHM SMD 0805
• Manufacturer: Vishay
• Type: NTCr

Specifications of NTCS0805E3104GXT

• Resistance In Ohms @ 25°c: 100K
• Resistance Tolerance: ±2%
• B Value Tolerance: ±1%
• B25/85: 4100K
• Operating Temperature: -40°C ~ 150°C
• Power - Max: 210mW
• Mounting Type: Surface Mount
• Package / Case: 0805 (2012 Metric)
• Description Of Terminals: Leadless
• Mounting Style: Surface Mount
• Pin Count: 2
• Screening Level: Automotive
• Sensitivity Index: 4100K
• Resistance @ 25c: 100kohm
• Thermal Time Constant: 10s
• Percentage Of Resistance Tolerance @ 25c: ±2
• Accuracy: ±1
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 150C
• Product Length (mm): 2mm
• Product Height (mm): 0.8mm
• Product Depth (mm): 1.25mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/50: -
• B25/75: -
• B25/100: -
• Lead Length: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: BC2563TR

SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 seconds should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with
PAPER TAPE
Document Number: 29044
Revision: 26-May-10
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D 0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A 0
50
B 0
P 1
P 2
Reflow Soldering
TEST METHOD
2 K/s
P 0
100
TC
Time (s)
150
For technical questions, contact:
10 s
10 s
1.3
40 s
Resistance to soldering heat
F
E 1
SMD 0805, Glass Protected
“IEC 60286-3”
200
W
Dimensions of the solder lands
Solderability
NTC Thermistors
1.0
TEST
T 1
T
250
. Basic dimensions are given below. Carrier tape material is paper.
3.0
Notes
(1)
(2)
NTCS0805E3.....T/2381 615 5....
PAPER TAPE DIMENSIONS in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
Measured 0.3 mm above base pocket
P
1
0
0
1
0
1
2
0
0
[e-mail]
(1)
(1)
(2)
cover tape
pitch cumulative error over any 10 pitches ± 1.0 mm
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
235 °C
260 °C
50
100
2 K/s
max.
Vishay BCcomponents
≈ 120 °C
DIMENSION
150
Time (s)
< 0.1
2.35
1.75
1.55
1.7
8.0
3.5
4.0
4.0
2.0
1.1
Min. 95 % of surface wetted
200
REQUIREMENTS
ΔR/R < 5 %
250
20 s min.
40 s max.
≈ 60 s
TOLERANCE
www.vishay.com
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.2
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
max.
-
350
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