NCP03YS330J05RL Murata Electronics North America, NCP03YS330J05RL Datasheet - Page 7

• Manufacturer Part Number: NCP03YS330J05RL
• Description: THERMISTOR 33 OHM NTC 0201 SMD
• Manufacturer: Murata Electronics North America
• Series: NCP03r

Specifications of NCP03YS330J05RL

• Resistance In Ohms @ 25°c: 33
• Resistance Tolerance: ±5%
• B Value Tolerance: ±3%
• B25/50: 2750K
• Operating Temperature: -40°C ~ 125°C
• Power - Max: 100mW
• Mounting Type: Surface Mount
• Package / Case: 0201 (0603 Metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/75: -
• B25/85: -
• B25/100: -
• Lead Length: -
• Other names: 490-4639-2

4
!Note
!Note
1. Mounting Position
2. Reflow Soldering Conditions
3. Flow Soldering Conditions
1
18
Chip Type !Caution/Notice
Notice (Soldering and Mounting)
Choose a mounting position that minimizes the stress
imposed on the chip during flexing or bending of the
board.
(NCP03/NCP15 Series)
(NCP18/NCP21 Series)
(NCP18/NCP21 Series)
Allowable Reflow Soldering Temperature and Time
Allowable Reflow Soldering Temperature and Time
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
Allowable Flow Soldering Temperature and Time
280
270
260
250
240
230
220
280
270
260
250
240
230
220
210
0
0
10
10
280
270
260
250
240
230
220
210
20 30 40 50 60 70
0
20 30 40 50 60 70 80
Time (sec.)
Time (sec.)
Time (sec.)
10
20
80
30
90
100
110
90
[Component Direction]
[Mounting Close to Board Separation Line]
300
200
100
300
200
100
300
200
100
Perforation
Holes
0
0
0
Standard Soldering Conditions
Standard Soldering Conditions
Preheating : 160 10 C, 1-2 min.
Soldering : 240-270 C, 20sec. max.
Preheating : 160 10 C, 1-2 min.
Soldering : 230-270 C, 20sec. max.
Standard Soldering Conditions
Preheating : 160 10 C, 1-2 min.
Soldering : 230-260 C, 10sec. max.
A
Preheating (in air)
Preheating (in air)
Preheating (in air)
Slit
B
1-2 min.
1-2 min.
1-2 min.
D
C
Soldering
20sec. max.
Soldering
Soldering
10sec. max.
20sec. max.
Continued on the following page.
Keep this product on the
PC Board away from the
Separation Line.
Worst
Gradual Cooling
Gradual Cooling
Gradual Cooling
(in air)
(in air)
(in air)
A-C-B-D
R44E9.pdf 05.4.13
Locate this
product
horizontal to the
direction in
which stress
acts.
Better