ERT-J0ER103J Panasonic - ECG, ERT-J0ER103J Datasheet - Page 4
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ERT-J0ER103J
Manufacturer Part Number
ERT-J0ER103J
Description
THERMISTOR NTC 10K OHM 5% 0402
Manufacturer
Panasonic - ECG
Series
ERT-Jr
Datasheet
1.ERT-JZEG103JA.pdf
(8 pages)
Specifications of ERT-J0ER103J
Resistance In Ohms @ 25°c
10K
Resistance Tolerance
±5%
B Value Tolerance
±2%
B25/50
4250K
B25/85
4300K
Operating Temperature
-40°C ~ 125°C
Power - Max
66mW
Mounting Type
Surface Mount
Package / Case
0402 (1005 Metric)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
B0/50
-
B25/75
-
B25/100
-
Lead Length
-
Other names
ERTJ0ER103J
P10574TR
P10574TR
■
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Rated Zero-power
Resistance (R
B Value
Adhesion
Bending Strength There shall be no cracks and other mechanical
Resistance to
Soldering Heat
Solderability
Specifi cation and Test Method
Item
25
)
Within the specifi ed tolerance.
Within the specifi ed tolerance.
✽ Individual Specifi cation shall specify B
The terminal electrode shall be free from peeling
or signs of peeling.
damage.
R
There shall be no cracks and other mechanical
damage.
R
B Value change : within ±1 %
More than 75 % of the soldered area of both
terminal electrodes shall be covered with fresh
solder.
25
25
B
25/85
change : within ±5 %
change
.
: within ±2 %
Nallow Tol. type Standard type
Specifi cation
– 366 –
within ±3 %
within ±2 %
25/50
or
The value of the d.c. resistance shall be measured at
the rated ambient temperature of 25.0 ±0.1 °C under
the power less than 0.1mW which is negligible self
heat generation.
The Zero-power resistances; R
measured respectively at T
The B value is calculated by the following equation.
Applied force :
Duration : 10 s
Size : 0201, 0402
Size : 0603
Bending distance : 1 mm
Bending speed
Soldering bath method
Solder temperature : 270 ±5 °C
Dipping period : 3.0 ±0.5 s
Preheat condition :
Soldering bath method
Solder temperature : 230 ±5 °C
Dipping period : 4 ±1 s
Solder : H63A (JIS–Z–3282)
B
T
1
Size 0201
Size 0402, 0603 : 5 N
/T
B
B
Step
2
25/50
25/85
=
1.0
1
2
1/(T
45±2
20
1
+273.15)–1/(T
Test Sample
Multilayer NTC Thermistors
kn (R
0.5R
25.0 ±0.1 °C
25.0 ±0.1 °C
150 to 200
Temp (°C)
80 to 100
R340
45±2
: 1 mm/s
Test Method
: 2 N
1
)–kn (R
T
Test
Sample
1
Board
0.3/Size:0201
0.5/Size:0402
Unit : mm
2
1
+273.15)
2
(°C) and T
)
1
Unit : mm
and R
50.0 ±0.1 °C
85.0 ±0.1 °C
120 to 180
120 to 180
Period (s)
2
, shall be
2
00
T
(°C).
2
Sep. 2010