TEMT6000X01 Vishay, TEMT6000X01 Datasheet - Page 4
![AMBIENT LIGHT SENSOR 1206 SMD](/photos/19/51/195120/temt6000x01_sml.jpg)
TEMT6000X01
Manufacturer Part Number
TEMT6000X01
Description
AMBIENT LIGHT SENSOR 1206 SMD
Manufacturer
Vishay
Type
Ambient Light Photo Sensor with Phototransistor Outputr
Specifications of TEMT6000X01
Wavelength
570nm
Output Type
Current
Package / Case
4.00mm L x 2.00mm W x 1.05mm H
Maximum Power Dissipation
100 mW
Maximum Dark Current
50 nA
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Product
Ambient Light Sensor
Transistor Polarity
NPN
Wavelength Typ
570nm
Power Consumption
100mW
Viewing Angle
60°
No. Of Pins
3
Msl
MSL 4 - 72 Hours
Power Dissipation Pd
100mW
Light Current
10µA
Transistor Case Style
1206
Half Angle
60°
Operating Temperature Range
-40°C To +100°C
Rohs Compliant
Yes
Base Number
6000
Dark Current
3nA
Svhc
No SVHC (20-Jun-2011)
Phototransistor Type
Phototransistor
Polarity
NPN
Number Of Elements
1
Lens Type
Transparent
Emitter-collector Voltage (max)
1.5V
Collector-emitter Voltage
6V
Collector Current (dc) (max)
20mA
Collector-emitter Sat Volt (max)
100(Typ)V
Dark Current (max)
50nA
Power Dissipation
100mW
Peak Wavelength
570nm
Half-intensity Angle
120deg
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
3
Package Type
SMD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
751-1055-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TEMT6000X01
Manufacturer:
Vishay Semiconductors
Quantity:
135
Company:
Part Number:
TEMT6000X01
Manufacturer:
COTO
Quantity:
10 000
Part Number:
TEMT6000X01
Manufacturer:
VISHAY/威世
Quantity:
20 000
TEMT6000X01
Vishay Semiconductors
Reflow Solder Profiles
www.vishay.com
4
19030
300
250
200
150
100
280
260
240
220
200
180
160
140
120
100
50
80
60
40
20
0
Figure 8. Tin (Sn) Reflow Solder Profile (Pb-free)
0
Figure 9. Lead Tin (SnPb) Reflow Solder Profile
0
0
max. 240 °C ca. 230 °C
125 °C
30
2 K/s to 4 K/s
50
60
90
Preheat
260 °C
90 s to 120 s
max. 160 °C
120 s
120
100
Time (s)
Time (s)
215 °C
145 °C
210 °C
250 °C
150
Reflow
150
180
Full Line: Typical
Dotted: Process Limits
~
~
10 s
Lead Temperature
30 s
40 s
max 40 s
210
~
20 s
200
Cooling
240
270
948625
250
300
Drypack
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a
desiccant.
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated in
J-STD-020. TEMT6000X01 is released for:
Moisture sensitivity level 4, according to JEDEC,
J-STD-020
Floor life: 72 h
Conditions: T
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (+ 5 °C), RH < 5 %.
amb
< 30 °C, RH < 60 %
Document Number 81579
Rev. 1.5, 28-Aug-07