28018 Parallax Inc, 28018 Datasheet - Page 7

• Manufacturer Part Number: 28018
• Description: MODULE SENSOR TEMP+HUMIDITY
• Manufacturer: Parallax Inc
• Series: Sensirion SHT11r

Specifications of 28018

• Output Type: Digital - 2-Wire
• Sensor Type: Humidity and Temperature
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Figure 15 SHT1x drawing and footprint dimensions in mm (inch)
SHT1x / SHT7x Relative Humidity & Temperature Sensor System
5
5.1 SHT1x (surface mountable)
Table 10 SHT1x Pin Description
5.1.1
The SHT1x is supplied in a surface-mountable LCC
(Leadless Chip Carrier) type package. The sensors housing
consists of a Liquid Crystal Polymer (LCP) cap with epoxy
glob top on a standard 0.8mm FR4 substrate. The device is
free of lead, Cd and Hg.
Device size is 7.42 x 4.88 x 2.5 mm (0.29 x 0.19 x 0.1 inch)
Weight 100mg
The production date is printed onto the cap in white numbers
in the form wwy. e.g. ”351” = week 35, 2001.
5.1.2
The SHT1x are shipped in standard IC tubes by 80 units per
tube or in 12mm tape. Reels are individually labelled with
barcode and human readable labels.
Carrier Tape
Figure 12 Tape configuration and unit orientation
www.sensirion.com
Pin Name
1
2
3
4
Cover Tape
Package Information
GND
DATA
SCK
VDD
NC
Package type
Delivery Conditions
1
2
3
4
NC
(0.04)
1.15
Trailer Tape
300mm minimum
2.44
(0.1)
Top View
4.88 (0.19)
Supply 2.4 – 5.5V
Remaining pins must be left unconnected
Comment
Ground
Serial data, bidirectional
Serial clock, input
(0.07)
1.9
(0.06)
1.49
Components
NC
NC
NC
NC
NC
sensor opening
actual size
Leader Tape
500mm minimum
Side View
v2.0 March 2003
5.1.3
Figure 13 SHT1x housing mounting example
Figure 14 SHT1x PCB Mounting example
5.1.4
Standard reflow soldering ovens may be used at maximum
235°C for 20 seconds.
For manual soldering contact time must be limited to 5
seconds at up to 350°C.
After soldering the devices should be stored at >74%RH for
at least 24h to allow the polymer to rehydrate.
Please consult the application note “Soldering procedure” for
more information.
housing
hou g
h
Mounting Examples
Soldering Information
ou
sing
si
ng g
Recommended PCB Footprint
(0.07)
1.8
PCB
7.08 (0.278)
3.48 (0.137)
Slit to minimize heat
transfer from the PCB
(0.07)
1.8
7/9